GP1S396HCPSF

GP1S396HCPSF
Attribute
Description
Manufacturer Part Number
GP1S396HCPSF
Description
SENSOR OPT SLOT NPN MODULE
Manufacturer Lead Time
Not specified

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Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line -
IC Encapsulation Type Tape & Reel (TR)Cut Tape (CT)Digi-Reel®
Availability Status Active
Proximity Detection Range 0.047" (1.2mm)
Detection Technology Type Through-Beam
Output Setup Options NPN - Open Collector
Max Forward DC Current 30 mA
Maximum Collector Amps 20 mA
Max Collector-Emitter Breakdown 35 V
Activation Speed ms 30µs
Ambient Temp Range -25°C ~ 85°C
Quality Grade Level -
Certification Qualification -
Attachment Mounting Style Surface Mount
Component Housing Style Module

Description

Provides a maximum collector current (Ic) of 20 mA. Provides a maximum DC forward current (If) rated at 30 mA. Mounting style Surface Mount for structural integrity. Operating temperature -25°C ~ 85°C for thermal stability. Output configuration NPN - Open Collector for system configuration. Enclosure Tape & Reel (TR)Cut Tape (CT)Digi-Reel® for component protection or transport. Enclosure/case Module providing mechanical and thermal shielding. Product condition Active for availability and lifecycle. Response duration 30µs for quick operation or detection. Detection distance 0.047" (1.2mm) for sensors or detectors. Detection method Through-Beam for device functionality. Highest collector-emitter breakdown voltage 35 V.

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