| Part Numbers | Manufacturer Name | Datasheet | Connector Usage | Connector Type | Connector Style | Number of Positions Loaded | Pitch | Number of Rows | Mounting Type | Termination | Contact Finish | Contact Finish Thickness | Color |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| MP2-H120-41S1-S-KR | 3M ELECTRONIC PRODUCTS DIVISION | Backplane | Header, Male Pins | Futurebus+® | All | 0.079" (2.00mm) | 4 | Through Hole | Solder | Gold | 30µin (0.76µm) | Beige | |
| MP2-H144-44P1-S-KR | 3M ELECTRONIC PRODUCTS DIVISION | Backplane | Header, Male Pins | Futurebus+® | All | 0.079" (2.00mm) | 4 | Through Hole | Press-Fit | Gold | 30µin (0.76µm) | Beige | |
| 5P03-2021-DA | 3M ELECTRONIC PRODUCTS DIVISION | - | Stackthrough, (PC/104) | PC/104 Plus | All | 0.079" (2.00mm) | 4 | Through Hole | Press-Fit | Gold | 3µin (0.08µm) | - | |
| MP2-H144-41P1-S-KR | 3M ELECTRONIC PRODUCTS DIVISION | Backplane | Header, Male Pins | Futurebus+® | All | 0.079" (2.00mm) | 4 | Through Hole | Press-Fit | Gold | 30µin (0.76µm) | Beige | |
| MP2-H096-41P5-S-KV | 3M ELECTRONIC PRODUCTS DIVISION | Backplane | Header, Male Pins | Futurebus+® | All | 0.079" (2.00mm) | 4 | Through Hole | Press-Fit | Gold | 30µin (0.76µm) | Beige | |
| HDC-H060-41S1-KR | 3M ELECTRONIC PRODUCTS DIVISION | Backplane | Header, Male Pins | High Density (HDC, HDI, HPC) | All | 0.100" (2.54mm) | 4 | Through Hole | Solder | Gold | 30µin (0.76µm) | Black | |
| MP2-H192-44S1-S-LR | 3M ELECTRONIC PRODUCTS DIVISION | Backplane | Header, Male Pins | Futurebus+® | All | 0.079" (2.00mm) | 4 | Through Hole | Solder | Gold | 3µin (0.08µm) | Beige | |
| MP2-H192-44P1-S-KR | 3M ELECTRONIC PRODUCTS DIVISION | Backplane | Header, Male Pins | Futurebus+® | All | 0.079" (2.00mm) | 4 | Through Hole | Press-Fit | Gold | 30µin (0.76µm) | Beige | |
| MP2-H192-44S2-S-KR | 3M ELECTRONIC PRODUCTS DIVISION | Backplane | Header, Male Pins | Futurebus+® | All | 0.079" (2.00mm) | 4 | Through Hole | Solder | Gold | 30µin (0.76µm) | Beige | |
| HDC-H100-41S1-KR | 3M ELECTRONIC PRODUCTS DIVISION | Backplane | Header, Male Pins | High Density (HDC, HDI, HPC) | All | 0.100" (2.54mm) | 4 | Through Hole | Solder | Gold | 30µin (0.76µm) | Black |
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