MP2-P270-51M1-LR |
3M ELECTRONIC PRODUCTS DIVISION |
|
Backplane
|
Header, Male Pins
|
Futurebus+®
|
All
|
0.079" (2.00mm)
|
5
|
Board Edge, Through Hole, Right Angle
|
Solder
|
Gold
|
3µin (0.08µm)
|
Beige
|
MP2-PS240-51P1-KR |
3M ELECTRONIC PRODUCTS DIVISION |
|
Backplane
|
Header, Male Pins
|
Futurebus+®
|
All
|
0.079" (2.00mm)
|
5
|
Through Hole
|
Press-Fit
|
Gold
|
30µin (0.76µm)
|
Beige
|
2P02-0100-ES |
3M ELECTRONIC PRODUCTS DIVISION |
|
Daughtercard
|
Receptacle, Female Sockets
|
AdvancedTCA®
|
All
|
-
|
-
|
Through Hole
|
Press-Fit
|
Gold
|
30µin (0.76µm)
|
-
|
MP2-S240-51H2-C-KR |
3M ELECTRONIC PRODUCTS DIVISION |
|
Backplane
|
Receptacle, Female Sockets
|
Futurebus+®
|
All
|
0.079" (2.00mm)
|
5
|
Board Edge, Through Hole, Right Angle
|
Solder
|
Gold
|
30µin (0.76µm)
|
Beige
|
HDC-H128-41S1-KR |
3M ELECTRONIC PRODUCTS DIVISION |
|
Backplane
|
Header, Male Pins
|
High Density (HDC, HDI, HPC)
|
All
|
0.100" (2.54mm)
|
4
|
Through Hole
|
Solder
|
Gold
|
30µin (0.76µm)
|
Black
|
HDC-H120-41S1-KR |
3M ELECTRONIC PRODUCTS DIVISION |
|
Backplane
|
Header, Male Pins
|
High Density (HDC, HDI, HPC)
|
All
|
0.100" (2.54mm)
|
4
|
Through Hole
|
Solder
|
Gold
|
30µin (0.76µm)
|
Black
|
MP2-P240-51M1-LR |
3M ELECTRONIC PRODUCTS DIVISION |
|
Backplane
|
Header, Male Pins
|
Futurebus+®
|
All
|
0.079" (2.00mm)
|
5
|
Board Edge, Through Hole, Right Angle
|
Solder
|
Gold
|
3µin (0.08µm)
|
Beige
|
MP2-PS300-51P1-LR |
3M ELECTRONIC PRODUCTS DIVISION |
|
Backplane
|
Header, Male Pins
|
Futurebus+®
|
All
|
0.079" (2.00mm)
|
5
|
Through Hole
|
Press-Fit
|
Gold
|
3µin (0.08µm)
|
Beige
|
MP2-PS300-51S1-KR |
3M ELECTRONIC PRODUCTS DIVISION |
|
Backplane
|
Header, Male Pins
|
Futurebus+®
|
All
|
0.079" (2.00mm)
|
5
|
Through Hole
|
Solder
|
Gold
|
30µin (0.76µm)
|
Beige
|
MP2-PS300-51S1-LR |
3M ELECTRONIC PRODUCTS DIVISION |
|
Backplane
|
Header, Male Pins
|
Futurebus+®
|
All
|
0.079" (2.00mm)
|
5
|
Through Hole
|
Solder
|
Gold
|
3µin (0.08µm)
|
Beige
|