Attribute
Description
Note :
GST will not be applied to orders shipping outside of India
Stock: 162
Distributor: 117
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 120 | ₹ 3,621.56 | ₹ 4,34,587.20 |
| 80 | ₹ 3,761.50 | ₹ 3,00,920.00 |
| 40 | ₹ 4,012.65 | ₹ 1,60,506.00 |
| 10 | ₹ 4,564.00 | ₹ 45,640.00 |
| 5 | ₹ 4,866.47 | ₹ 24,332.35 |
| 1 | ₹ 5,647.18 | ₹ 5,647.18 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | C400 | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Device Type Classification | Wire Solder | |
| Material Blend | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | |
| Circular Measurement | 0.022" (0.56mm) | |
| Fusion Temperature | 423°F (217°C) | |
| Solder Flux Category | No-Clean | |
| AWG Wire Size | 23 AWG, 24 SWG | |
| Filter Mesh Design | - | |
| Manufacturing Process Type | Lead Free | |
| Physical Form Factor | Spool, 8.8 oz (250g) | |
| Storage Duration Limit | - | |
| Expiration Start Date | - | |
| Cool Storage Temp Range | 59°F ~ 86°F (15°C ~ 30°C) |
Description
Crafted from a material mixture described as Sn96.5Ag3Cu0.5 (96.5/3/0.5). Supplies diameter quantified at 0.022" (0.56mm). Utilizes a flux type categorized as No-Clean. Employs a form factor characterized as Spool, 8.8 oz (250g). Melting temperature 423°F (217°C) for thermal and material integrity. Enclosure Bulk for component protection or transport. Type of process Lead Free for operational or production context. Product condition Active for availability and lifecycle. Product or component classification series C400. Storage/refrigeration temperature 59°F ~ 86°F (15°C ~ 30°C) to ensure material safety. Category Wire Solder for classification or specification. Gauge of wire 23 AWG, 24 SWG for electrical standards.
