Attribute
Description
Manufacturer Part Number
386857
Manufacturer
Description
63/37 400 3% .032DIA 20AWG
Manufacturer Lead Time
Not specified
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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | C400 | |
| IC Encapsulation Type | Spool | |
| Availability Status | Obsolete | |
| Device Type Classification | Wire Solder | |
| Material Blend | Sn63Pb37 (63/37) | |
| Circular Measurement | 0.032" (0.81mm) | |
| Fusion Temperature | 361°F (183°C) | |
| Solder Flux Category | No-Clean | |
| AWG Wire Size | 20 AWG, 21 SWG | |
| Filter Mesh Design | - | |
| Manufacturing Process Type | Leaded | |
| Physical Form Factor | Spool, 1 lb (454 g) | |
| Storage Duration Limit | - | |
| Expiration Start Date | - | |
| Cool Storage Temp Range | - |
Description
Crafted from a material mixture described as Sn63Pb37 (63/37). Supplies diameter quantified at 0.032" (0.81mm). Utilizes a flux type categorized as No-Clean. Employs a form factor characterized as Spool, 1 lb (454 g). Melting temperature 361°F (183°C) for thermal and material integrity. Enclosure Spool for component protection or transport. Type of process Leaded for operational or production context. Product condition Obsolete for availability and lifecycle. Product or component classification series C400. Category Wire Solder for classification or specification. Gauge of wire 20 AWG, 21 SWG for electrical standards.
