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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | LOCTITE® GC 50 | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Device Type Classification | Solder Paste | |
| Material Blend | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | |
| Circular Measurement | - | |
| Fusion Temperature | 423°F (217°C) | |
| Solder Flux Category | No-Clean | |
| AWG Wire Size | - | |
| Filter Mesh Design | 5 | |
| Manufacturing Process Type | Lead Free | |
| Physical Form Factor | Cartridge | |
| Storage Duration Limit | 6 Months | |
| Expiration Start Date | Date of Manufacture | |
| Cool Storage Temp Range | 41°F ~ 77°F (5°C ~ 25°C) |
Description
Crafted from a material mixture described as Sn96.5Ag3Cu0.5 (96.5/3/0.5). Utilizes a flux type categorized as No-Clean. Employs a form factor characterized as Cartridge. Melting temperature 423°F (217°C) for thermal and material integrity. Mesh variant 5 for material or airflow requirements. Enclosure Bulk for component protection or transport. Type of process Lead Free for operational or production context. Product condition Active for availability and lifecycle. Product or component classification series LOCTITE® GC 50. Product lifespan 6 Months for longevity. Beginning of shelf life Date of Manufacture for tracking storage. Storage/refrigeration temperature 41°F ~ 77°F (5°C ~ 25°C) to ensure material safety. Category Solder Paste for classification or specification.
