Stock: 584
Distributor: 117
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ₹ 707.23 | ₹ 707.23 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | Smooth Flow™ | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Device Type Classification | Solder Paste | |
| Material Blend | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | |
| Circular Measurement | - | |
| Fusion Temperature | 280°F (138°C) | |
| Solder Flux Category | No-Clean | |
| AWG Wire Size | - | |
| Filter Mesh Design | 4 | |
| Manufacturing Process Type | Lead Free | |
| Physical Form Factor | Syringe, 0.35 oz (10g), 5cc | |
| Storage Duration Limit | 6 Months | |
| Expiration Start Date | Date of Manufacture | |
| Cool Storage Temp Range | 37°F ~ 46°F (3°C ~ 8°C) |
Description
Crafted from a material mixture described as Bi57.6Sn42Ag0.4 (57.6/42/0.4). Utilizes a flux type categorized as No-Clean. Employs a form factor characterized as Syringe, 0.35 oz (10g), 5cc. Melting temperature 280°F (138°C) for thermal and material integrity. Mesh variant 4 for material or airflow requirements. Enclosure Bulk for component protection or transport. Type of process Lead Free for operational or production context. Product condition Active for availability and lifecycle. Product or component classification series Smooth Flow™. Product lifespan 6 Months for longevity. Beginning of shelf life Date of Manufacture for tracking storage. Storage/refrigeration temperature 37°F ~ 46°F (3°C ~ 8°C) to ensure material safety. Category Solder Paste for classification or specification.
