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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | HVC | |
| IC Encapsulation Type | Tape & Reel (TR)Cut Tape (CT)Digi-Reel® | |
| Availability Status | Active | |
| Ohm Resistance Value | 50 MOhms | |
| Accuracy Tolerance Percentage | ±10% | |
| Wattage Power Level | 2W | |
| Material Blend | Thick Film | |
| Key Product Highlights | High Voltage, Moisture Resistant, Pulse Withstanding | |
| Temp Drift Factor | ±100ppm/°C | |
| Ambient Temp Range | -55°C ~ 150°C | |
| Component Housing Style | 2512 (6332 Metric) | |
| Performance Rating Specs | - | |
| Vendor Package Type | 2512 | |
| Package Size Specs | 0.250" L x 0.125" W (6.35mm x 3.18mm) | |
| Maximum Mounted Height | 0.030" (0.76mm) | |
| End Connection Points | 2 | |
| Reliability Failure Metric | - |
Description
Crafted from a material mixture described as Thick Film. Comprises contacts characterized as 2 for dependable interfacing. Furnished with features classified as High Voltage, Moisture Resistant, Pulse Withstanding. Maximum seated height of 0.030" (0.76mm) for components mounted on the board. Count of terminations 2 for effective connection configuration. Operating temperature -55°C ~ 150°C for thermal stability. Enclosure Tape & Reel (TR)Cut Tape (CT)Digi-Reel® for component protection or transport. Enclosure/case 2512 (6332 Metric) providing mechanical and thermal shielding. Enclosure type 2512 ensuring device integrity. Power measured in watts 2W for operational capability. Product condition Active for availability and lifecycle. Resistance value 50 MOhms for electrical efficiency. Product or component classification series HVC. Dimensions 0.250" L x 0.125" W (6.35mm x 3.18mm) for mechanical or electrical components. Dimension measurement 0.250" L x 0.125" W (6.35mm x 3.18mm) for component details. Manufacturer package type 2512 for component choice. Coefficient of temperature ±100ppm/°C for stability in performance. Tolerance ±10% for precision in manufacturing.
