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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | ORNV | |
| IC Encapsulation Type | Tape & Reel (TR) | |
| Availability Status | Active | |
| Circuit Configuration Style | Voltage Divider | |
| Ohm Value Specification | 5k | |
| Accuracy Tolerance Percentage | ±0.1% | |
| Resistor Component Total | 5 | |
| Resistor Pair Balance | ±0.05% | |
| Ratio Stability Over Time | ±5ppm/°C | |
| IC Pin Total | 8 | |
| Wattage per Component | 100mW | |
| Temp Drift Factor | ±25ppm/°C | |
| Ambient Temp Range | -55°C ~ 125°C | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Intended Uses | Voltage Divider (TCR Matched) | |
| Attachment Mounting Style | Surface Mount | |
| Component Housing Style | 8-SOIC (0.154", 3.90mm Width) | |
| Vendor Package Type | 8-SOIC | |
| Package Size Specs | 0.194" L x 0.157" W (4.93mm x 3.99mm) | |
| Maximum Mounted Height | 0.068" (1.73mm) |
Description
Ideally suited for scenarios involving Voltage Divider (TCR Matched). Utilizes a circuit type categorized as Voltage Divider. Maximum seated height of 0.068" (1.73mm) for components mounted on the board. Mounting style Surface Mount for structural integrity. Total pins 8 for connectors or integrated circuits. Total resistors 5 for circuit design. Operating temperature -55°C ~ 125°C for thermal stability. Enclosure Tape & Reel (TR) for component protection or transport. Enclosure/case 8-SOIC (0.154", 3.90mm Width) providing mechanical and thermal shielding. Enclosure type 8-SOIC ensuring device integrity. Energy per unit 100mW for modular system assessment. Product condition Active for availability and lifecycle. Resistance measured in ohms 5k for precise electrical details. Matching ratio of resistors ±0.05% for high-precision circuits. Resistor ratio variation ±5ppm/°C for temperature stability. Product or component classification series ORNV. Dimensions 0.194" L x 0.157" W (4.93mm x 3.99mm) for mechanical or electrical components. Dimension measurement 0.194" L x 0.157" W (4.93mm x 3.99mm) for component details. Manufacturer package type 8-SOIC for component choice. Coefficient of temperature ±25ppm/°C for stability in performance. Tolerance ±0.1% for precision in manufacturing.