Home Products Single Board Computers And Sbc Modules Single Board Computer Systems

Stocking Options

Environmental Options

Media

9 Results

Manufacturer1

Product Series Line0

IC Encapsulation Type0

Availability Status0

Central CPU Unit0

Operational Speed Rating0

Processor Core Number0

Wattage Power Level0

Thermal Management Method0

Package Size Specs0

Device Size Standard0

Expansion Slot Bus Type0

Installed RAM Volume0

Memory Bus Interface0

Display Video Ports0

Network Ethernet Standard0

USB Interface Version0

Serial Port Standards0

Digital Input/Output Pins0

Analog Signal In to Out0

System Monitor Timer0

Included Components0

Ambient Temp Range0

Manufacturer

FORLINX EMBEDDED

Part Number
Manufacturer
Price
Product Series Line
IC Encapsulation Type
Availability Status
Central CPU Unit
Operational Speed Rating
Processor Core Number
Wattage Power Level
Thermal Management Method
Package Size Specs
Device Size Standard
Expansion Slot Bus Type
Installed RAM Volume
Memory Bus Interface
Display Video Ports
Network Ethernet Standard
USB Interface Version
Serial Port Standards
Digital Input/Output Pins
Analog Signal In to Out
System Monitor Timer
Included Components
Ambient Temp Range
img
FORLINX-OKMX6ULL-S+08256SN256IA12C12 FORLINX EMBEDDED
FORLINX EMBEDDED
-
-
Bulk
Active
ARM® Cortex®-A7
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
img
FORLINX-OKMX8MM-C+182GSE8GCA10I11 FORLINX EMBEDDED
FORLINX EMBEDDED
-
-
Bulk
Active
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
img
FORLINX-OK3506J-S+15256SN256IA10I10 FORLINX EMBEDDED
FORLINX EMBEDDED
-
*
Retail Package
Active
ARM® Cortex®-A7
1.6GHz
4
1.5W (Typical)
Heat Sink
5.120" x 7.480" (130.04mm x 189.99mm)
SBC
-
256MB
eMMC, SSD
MIPI-DSI, RGB
10/100Mbps RJ45 (2)
USB 2.0 (2)
-
-
-
Yes
-
-40°C ~ 85°C
img
FORLINX-OK-MX8MPQ-SMARC+162GSE16GI FORLINX EMBEDDED
FORLINX EMBEDDED
-
*
Retail Package
Active
ARM® Cortex®-A53, ARM® Cortex®-M7
1.6GHz
4/1
3.1W
Heat Sink
5.120" x 7.480" (130.04mm x 189.99mm)
SMARC v2.1
-
2GB
eMMC, SSD
HDMI, LVDS, MIPI DSI
10/100/1000 Mbps (2)
USB 2.0 (5), USB 3.0 (2)
-
-
-
Yes
Power Supply
-40°C ~ 85°C
img
FORLINX-OK536-C+201GSE8GIA10I11 FORLINX EMBEDDED
FORLINX EMBEDDED
-
*
Retail Package
Active
ARM® Cortex®-A55
1.6GHz
4
3.8W
Heat Sink
5.120" x 7.480" (130.04mm x 189.99mm)
SBC
-
1GB
eMMC, SSD
-
10/100/1000Mbps, RJ45(2)
USB 2.0 (3), USB 3.0 (1)
-
-
-
Yes
-
-40°C ~ 85°C
img
FORLINX-OK3506J-S+15512SE8GIB10I10 FORLINX EMBEDDED
FORLINX EMBEDDED
-
*
Retail Package
Active
ARM® Cortex®-A7
1.6GHz
4
1.5W (Typical)
Heat Sink
5.120" x 7.480" (130.04mm x 189.99mm)
SBC
-
512MB
eMMC, SSD
MIPI-DSI, RGB
10/100Mbps RJ45 (2)
USB 2.0 (2)
-
-
-
Yes
-
-40°C ~ 85°C
img
FORLINX-OK536-C+202GSE16GIB10I11 FORLINX EMBEDDED
FORLINX EMBEDDED
-
*
Retail Package
Active
ARM® Cortex®-A55
1.6GHz
4
3.8W
Heat Sink
5.120" x 7.480" (130.04mm x 189.99mm)
SBC
-
2GB
eMMC, SSD
-
10/100/1000Mbps, RJ45(2)
USB 2.0 (3), USB 3.0 (1)
-
-
-
Yes
-
-40°C ~ 85°C
img
FORLINX-OK-MX8MPQ-SMARC+164GSE32GI FORLINX EMBEDDED
FORLINX EMBEDDED
-
*
Retail Package
Active
ARM® Cortex®-A53, ARM® Cortex®-M7
1.6GHz
4/1
3.3W
Heat Sink
5.120" x 7.480" (130.04mm x 189.99mm)
SMARC v2.1
-
4GB
eMMC, SSD
HDMI, LVDS, MIPI DSI
10/100/1000 Mbps (2)
USB 2.0 (5), USB 3.0 (2)
-
-
-
Yes
Power Supply
-40°C ~ 85°C
img
FORLINX-OK536N-C+202GSE16GIA10I11 FORLINX EMBEDDED
FORLINX EMBEDDED
-
*
Retail Package
Active
ARM® Cortex®-A55
1.6GHz
4
3.8W
Heat Sink
5.120" x 7.480" (130.04mm x 189.99mm)
SBC
-
2GB
eMMC, SSD
-
10/100/1000Mbps, RJ45(2)
USB 2.0 (3), USB 3.0 (1)
-
-
-
Yes
-
-40°C ~ 85°C
MANUFACTURERS: 3 Y POWER TECHNOLOGY | 3D SYSTEMS INC | 3D PLUS | 3E SECURITY | ACTION TUNGSRAM INC | ACP OPTOELECTRONIC TECHNOLOGY CO LTD | ACME ELECTRIC CORP | ACCUTEK MICROCIRCUIT CORP | ADVANCED CERAMIC X CORP

Stay Up to Date

Subscribe to our newsletter to receiveour weekly feed.