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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Interface Connector Category | DIP to DIP | |
| Switch Position Options | 40 | |
| Grid Row Count | 2 | |
| Plug Pin Spacing | 0.100" (2.54mm) | |
| Cable Wire Pitch | 0.050" (1.27mm) | |
| Linear Length Dimension | 0.500' (152.40mm, 6.00") | |
| Key Product Highlights | - | |
| Visual Hue | Multiple, Ribbon | |
| Electromagnetic Interference Protection | Unshielded | |
| Intended Usage Scenario | Socket (0.6"), Board In | |
| Wire End Connection | IDC | |
| Pin Surface Treatment | Tin | |
| Pin Coating Depth | 100.0µin (2.54µm) |
Description
Utilizes a cable termination style referred to as IDC. Available in a color identified as Multiple, Ribbon to enhance system aesthetics. Incorporates a connector type labeled as DIP to DIP. Includes contact finish plated at Tin to enhance conductivity. Presents contact finish thickness recorded at 100.0µin (2.54µm). Total length 0.500' (152.40mm, 6.00") for size reference. Total positions 40 for switches or mechanical elements. Total rows 2 for matrix or display setup. Enclosure Bulk for component protection or transport. Pitch of cable 0.050" (1.27mm) for spacing of conductors. Connector spacing 0.100" (2.54mm) for correct mating. Product condition Active for availability and lifecycle. Shielding Unshielded for EMI/RFI shielding. Application Socket (0.6"), Board In for intended use or function.
