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Manufacturer1

Product Series Line0

IC Encapsulation Type0

Availability Status0

Core Technology Platform0

Device Type Classification0

Galvanic Isolation Supply0

Audio/Video Channel Count0

Dual Side Input Counts0

Signal Path Design0

Isolation Barrier Voltage0

Minimum Surge Tolerance0

Transfer Speed Mbps0

Max Low-to-High/High-to-Low Delay0

Max Pulse Skew0

Typical Edge Transition Time0

Power Supply Voltage0

Quality Grade Level0

Certification Qualification0

Ambient Temp Range0

Attachment Mounting Style0

Component Housing Style0

Vendor Package Type0

Manufacturer

SEMICON COMPONENTS INC

Part Number
Manufacturer
Price
Product Series Line
IC Encapsulation Type
Availability Status
Core Technology Platform
Device Type Classification
Galvanic Isolation Supply
Audio/Video Channel Count
Dual Side Input Counts
Signal Path Design
Isolation Barrier Voltage
Minimum Surge Tolerance
Transfer Speed Mbps
Max Low-to-High/High-to-Low Delay
Max Pulse Skew
Typical Edge Transition Time
Power Supply Voltage
Quality Grade Level
Certification Qualification
Ambient Temp Range
Attachment Mounting Style
Component Housing Style
Vendor Package Type
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PAI122M31Q SEMICON COMPONENTS INC
SEMICON COMPONENTS INC
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MANUFACTURERS: 3 Y POWER TECHNOLOGY | 3D SYSTEMS INC | 3D PLUS | 3E SECURITY | ACTION TUNGSRAM INC | ACP OPTOELECTRONIC TECHNOLOGY CO LTD | ACME ELECTRIC CORP | ACCUTEK MICROCIRCUIT CORP | ADVANCED CERAMIC X CORP

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