CYV15G0404DXB-BGXC
Data Sheet
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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | HOTlink II™ | |
| IC Encapsulation Type | Tray | |
| Availability Status | Obsolete | |
| Primary Function Mode | - | |
| User Interface Type | LVTTL | |
| Electrical Circuit Count | 4 | |
| Power Supply Voltage | 3.135V ~ 3.465V | |
| Power Supply Amperage | 900mA | |
| Wattage Power Level | - | |
| Ambient Temp Range | 0°C ~ 70°C | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Attachment Mounting Style | Surface Mount | |
| Component Housing Style | 256-BGA Exposed Pad | |
| Vendor Package Type | 256-L2BGA (27x27) |
Description
Utilizes supply current defined as 900mA. Interface tailored for LVTTL operation and interaction. Mounting style Surface Mount for structural integrity. Total circuits 4 for electrical or electronic designs. Operating temperature 0°C ~ 70°C for thermal stability. Enclosure Tray for component protection or transport. Enclosure/case 256-BGA Exposed Pad providing mechanical and thermal shielding. Enclosure type 256-L2BGA (27x27) ensuring device integrity. Product condition Obsolete for availability and lifecycle. Product or component classification series HOTlink II™. Manufacturer package type 256-L2BGA (27x27) for component choice. Voltage supply 3.135V ~ 3.465V for electrical needs. Operating supply voltage 3.135V ~ 3.465V for the device.
