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| 1 | ₹ 39,292.61 | ₹ 39,292.61 |
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| 1 | ₹ 42,905.40 | ₹ 42,905.40 |
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| 1 | ₹ 42,923.81 | ₹ 42,923.81 |
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Distributor: 121
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| 1 | ₹ 44,195.58 | ₹ 44,195.58 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | Zynq® UltraScale+™ MPSoC CG | |
| IC Encapsulation Type | Tray | |
| Availability Status | Active | |
| System Design Structure | MCU, FPGA | |
| Central CPU Unit | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | |
| Non-Volatile Flash Memory | - | |
| Random Access Memory Bytes | 256KB | |
| External Device Support | DMA, WDT | |
| Interconnect Options | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |
| Operational Speed Rating | 500MHz, 1.2GHz | |
| Key Feature Specifications | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | |
| Ambient Temp Range | 0°C ~ 100°C (TJ) | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Component Housing Style | 784-BFBGA, FCBGA | |
| Vendor Package Type | 784-FCBGA (23x23) |
Description
Employs a MCU, FPGA framework for enhanced efficiency. Offers connectivity alternatives specified by CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG for smooth integration. Incorporates core processor recognized as Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ for rapid processing. Operating temperature 0°C ~ 100°C (TJ) for thermal stability. Enclosure Tray for component protection or transport. Enclosure/case 784-BFBGA, FCBGA providing mechanical and thermal shielding. Enclosure type 784-FCBGA (23x23) ensuring device integrity. External devices DMA, WDT for system connectivity and expansion. Key characteristics Zynq®UltraScale+™ FPGA, 154K+ Logic Cells outlining main features. Product condition Active for availability and lifecycle. Size of RAM 256KB for system or device specifications. Product or component classification series Zynq® UltraScale+™ MPSoC CG. Velocity 500MHz, 1.2GHz for mechanical or data efficiency. Manufacturer package type 784-FCBGA (23x23) for component choice.
