FSA660TMX

FSA660TMX
Attribute
Description
Manufacturer Part Number
FSA660TMX
Manufacturer
Description
IC SWITCH 2:1 MIPI C-PHY 18TMLP
Manufacturer Lead Time
53 weeks

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Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line -
IC Encapsulation Type Tape & Reel (TR)Cut Tape (CT)Digi-Reel®
Availability Status Active
Intended Uses MIPI
Signal Mux/Demux Channels 2:1
Circuit Switching Type SPDT
Audio/Video Channel Count 1
Maximum On Resistance 8Ohm
Single Positive Supply 1.5V ~ 5V
Dual Symmetric Supply -
3dB Bandwidth 5GHz
Key Product Highlights Break-Before-Make
Ambient Temp Range -40°C ~ 85°C (TA)
Quality Grade Level -
Certification Qualification -
Attachment Mounting Style Surface Mount
Component Housing Style 18-XFQFN Exposed Pad
Vendor Package Type 18-TMLP (2x2.8)

Description

Provides a -3dB bandwidth of 5GHz to ensure consistent signal quality. Ideally suited for scenarios involving MIPI. Offers 1 available channels for enhanced functionality. Furnished with features classified as Break-Before-Make. Mounting style Surface Mount for structural integrity. Mux/demux circuit 2:1 for signal management. Total channels 1 for input/output or communication. Resistance in the on-state 8Ohm for efficient conduction. Peak on-state resistance 8Ohm for electrical efficiency. Operating temperature -40°C ~ 85°C (TA) for thermal stability. Enclosure Tape & Reel (TR)Cut Tape (CT)Digi-Reel® for component protection or transport. Enclosure/case 18-XFQFN Exposed Pad providing mechanical and thermal shielding. Enclosure type 18-TMLP (2x2.8) ensuring device integrity. Product condition Active for availability and lifecycle. Manufacturer package type 18-TMLP (2x2.8) for component choice. Circuit switch SPDT for functionality. Single voltage supply V+ 1.5V ~ 5V for electronic systems.

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