SFEM128GB2ED1TO-I-7G-111-STD

SFEM128GB2ED1TO-I-7G-111-STD
Attribute
Description
Manufacturer Part Number
SFEM128GB2ED1TO-I-7G-111-STD
Manufacturer
Description
IC FLASH 1TBIT EMMC 153BGA
Note : GST will not be applied to orders shipping outside of India

Stock:
2

Distributor: 117

Lead Time: Not specified

Quantity Unit Price Ext. Price
100 ₹ 3,913.25 ₹ 3,91,325.00
50 ₹ 4,014.68 ₹ 2,00,734.00
25 ₹ 4,117.64 ₹ 1,02,941.00
10 ₹ 4,255.67 ₹ 42,556.70
1 ₹ 4,606.35 ₹ 4,606.35

Stock:
8

Distributor: 130

Lead Time: Not specified


Quantity Unit Price Ext. Price
1 ₹ 4,245.82 ₹ 4,245.82
5 ₹ 4,170.94 ₹ 20,854.70
10 ₹ 4,096.06 ₹ 40,960.60
25 ₹ 3,949.74 ₹ 98,743.50
50 ₹ 3,786.73 ₹ 1,89,336.50

Stock:
998

Distributor: 108

Lead Time: Not specified


Quantity Unit Price Ext. Price
1 ₹ 4,395.71 ₹ 4,395.71
10 ₹ 4,251.53 ₹ 42,515.30
25 ₹ 4,112.69 ₹ 1,02,817.25
50 ₹ 3,981.86 ₹ 1,99,093.00
100 ₹ 3,819.88 ₹ 3,81,988.00

Stock:
3

Distributor: 111

Lead Time: Not specified


Quantity Unit Price Ext. Price
3 ₹ 4,506.28 ₹ 13,518.84
2 ₹ 4,667.38 ₹ 9,334.76

Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line EM-30
IC Encapsulation Type Tray
Availability Status Active
RAM Technology Category Non-Volatile
Storage Media Type FLASH
Core Technology Platform FLASH - NAND (TLC)
Total Memory Bytes 1Tbit
Storage Layout Structure 128G x 8
Data Access Bus eMMC
Timing Pulse Rate 200 MHz
Memory Write Speed Word/Page -
Data Retrieval Speed -
Power Supply Voltage 2.7V ~ 3.6V
Ambient Temp Range -40°C ~ 85°C
Quality Grade Level -
Certification Qualification -
Attachment Mounting Style Surface Mount
Component Housing Style 153-TFBGA
Vendor Package Type 153-BGA (11.5x13)

Description

Functions at a clock frequency of 200 MHz. Storage format FLASH for data interoperability. Memory bus eMMC for connectivity and performance. Memory arrangement 128G x 8 for optimal data retrieval. Memory total 1Tbit for device storage capability. Memory classification Non-Volatile for efficiency and compatibility. Mounting style Surface Mount for structural integrity. Operating temperature -40°C ~ 85°C for thermal stability. Enclosure Tray for component protection or transport. Enclosure/case 153-TFBGA providing mechanical and thermal shielding. Enclosure type 153-BGA (11.5x13) ensuring device integrity. Product condition Active for availability and lifecycle. Product or component classification series EM-30. Manufacturer package type 153-BGA (11.5x13) for component choice. Voltage supply 2.7V ~ 3.6V for electrical needs. Platform technology FLASH - NAND (TLC) for the type of product. Operating supply voltage 2.7V ~ 3.6V for the device.

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