Stock: 3
Distributor: 123
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ₹ 3,451.42 | ₹ 3,451.42 |
| 5 | ₹ 3,451.42 | ₹ 17,257.10 |
| 10 | ₹ 3,451.42 | ₹ 34,514.20 |
| 25 | ₹ 3,451.42 | ₹ 86,285.50 |
| 50 | ₹ 3,451.42 | ₹ 1,72,571.00 |
| 100 | ₹ 3,451.42 | ₹ 3,45,142.00 |
Stock: 3
Distributor: 117
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 100 | ₹ 4,455.84 | ₹ 4,45,584.00 |
| 50 | ₹ 4,571.52 | ₹ 2,28,576.00 |
| 25 | ₹ 4,689.09 | ₹ 1,17,227.25 |
| 10 | ₹ 4,846.76 | ₹ 48,467.60 |
| 1 | ₹ 5,248.33 | ₹ 5,248.33 |
Stock: 51
Distributor: 108
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ₹ 4,927.04 | ₹ 4,927.04 |
| 10 | ₹ 4,668.05 | ₹ 46,680.50 |
| 25 | ₹ 4,516.75 | ₹ 1,12,918.75 |
| 50 | ₹ 4,402.83 | ₹ 2,20,141.50 |
| 100 | ₹ 4,072.64 | ₹ 4,07,264.00 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | EM-30 | |
| IC Encapsulation Type | Tray | |
| Availability Status | Active | |
| RAM Technology Category | Non-Volatile | |
| Storage Media Type | FLASH | |
| Core Technology Platform | FLASH - NAND (TLC) | |
| Total Memory Bytes | 1Tbit | |
| Storage Layout Structure | 128G x 8 | |
| Data Access Bus | eMMC | |
| Timing Pulse Rate | 200 MHz | |
| Memory Write Speed Word/Page | - | |
| Data Retrieval Speed | - | |
| Power Supply Voltage | 2.7V ~ 3.6V | |
| Ambient Temp Range | -40°C ~ 105°C | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Attachment Mounting Style | Surface Mount | |
| Component Housing Style | 153-TFBGA | |
| Vendor Package Type | 153-BGA (11.5x13) |
Description
Functions at a clock frequency of 200 MHz. Storage format FLASH for data interoperability. Memory bus eMMC for connectivity and performance. Memory arrangement 128G x 8 for optimal data retrieval. Memory total 1Tbit for device storage capability. Memory classification Non-Volatile for efficiency and compatibility. Mounting style Surface Mount for structural integrity. Operating temperature -40°C ~ 105°C for thermal stability. Enclosure Tray for component protection or transport. Enclosure/case 153-TFBGA providing mechanical and thermal shielding. Enclosure type 153-BGA (11.5x13) ensuring device integrity. Product condition Active for availability and lifecycle. Product or component classification series EM-30. Manufacturer package type 153-BGA (11.5x13) for component choice. Voltage supply 2.7V ~ 3.6V for electrical needs. Platform technology FLASH - NAND (TLC) for the type of product. Operating supply voltage 2.7V ~ 3.6V for the device.
