SFEM128GB2ED1TB-I-EF-121-STD

SFEM128GB2ED1TB-I-EF-121-STD
Attribute
Description
Manufacturer Part Number
SFEM128GB2ED1TB-I-EF-121-STD
Manufacturer
Description
IC FLASH 1TBIT EMMC 153BGA
Note : GST will not be applied to orders shipping outside of India

Stock:
16

Distributor: 116

Lead Time: Not specified

Quantity Unit Price Ext. Price
16 ₹ 3,035.36 ₹ 48,565.76
8 ₹ 3,143.85 ₹ 25,150.80
4 ₹ 3,185.27 ₹ 12,741.08
2 ₹ 3,271.36 ₹ 6,542.72
1 ₹ 3,458.28 ₹ 3,458.28

Stock:
6

Distributor: 117

Lead Time: Not specified


Quantity Unit Price Ext. Price
250 ₹ 3,495.04 ₹ 8,73,760.00
100 ₹ 3,616.13 ₹ 3,61,613.00
50 ₹ 3,709.75 ₹ 1,85,487.50
25 ₹ 3,804.75 ₹ 95,118.75
10 ₹ 3,932.02 ₹ 39,320.20
1 ₹ 4,255.09 ₹ 4,255.09

Stock:
50

Distributor: 131

Lead Time: Not specified


Quantity Unit Price Ext. Price
152 ₹ 3,873.28 ₹ 5,88,738.56

Stock:
10

Distributor: 108

Lead Time: Not specified


Quantity Unit Price Ext. Price
1 ₹ 4,235.51 ₹ 4,235.51
10 ₹ 3,913.33 ₹ 39,133.30
25 ₹ 3,668.58 ₹ 91,714.50
50 ₹ 3,576.02 ₹ 1,78,801.00
100 ₹ 3,461.21 ₹ 3,46,121.00

Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line EM-30
IC Encapsulation Type Tray
Availability Status Active
RAM Technology Category Non-Volatile
Storage Media Type FLASH
Core Technology Platform FLASH - NAND (TLC)
Total Memory Bytes 1Tbit
Storage Layout Structure 128G x 8
Data Access Bus eMMC_5.1
Timing Pulse Rate 200 MHz
Memory Write Speed Word/Page -
Data Retrieval Speed -
Power Supply Voltage 2.7V ~ 3.6V
Ambient Temp Range -40°C ~ 85°C (TA)
Quality Grade Level -
Certification Qualification -
Attachment Mounting Style Surface Mount
Component Housing Style 153-TFBGA
Vendor Package Type 153-BGA (11.5x13)

Description

Functions at a clock frequency of 200 MHz. Storage format FLASH for data interoperability. Memory bus eMMC_5.1 for connectivity and performance. Memory arrangement 128G x 8 for optimal data retrieval. Memory total 1Tbit for device storage capability. Memory classification Non-Volatile for efficiency and compatibility. Mounting style Surface Mount for structural integrity. Operating temperature -40°C ~ 85°C (TA) for thermal stability. Enclosure Tray for component protection or transport. Enclosure/case 153-TFBGA providing mechanical and thermal shielding. Enclosure type 153-BGA (11.5x13) ensuring device integrity. Product condition Active for availability and lifecycle. Product or component classification series EM-30. Manufacturer package type 153-BGA (11.5x13) for component choice. Voltage supply 2.7V ~ 3.6V for electrical needs. Platform technology FLASH - NAND (TLC) for the type of product. Operating supply voltage 2.7V ~ 3.6V for the device.

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