Stock: 71
Distributor: 117
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 5088 | ₹ 130.45 | ₹ 6,63,729.60 |
| 1056 | ₹ 138.21 | ₹ 1,45,949.76 |
| 576 | ₹ 141.26 | ₹ 81,365.76 |
| 288 | ₹ 144.78 | ₹ 41,696.64 |
| 192 | ₹ 146.84 | ₹ 28,193.28 |
| 96 | ₹ 150.38 | ₹ 14,436.48 |
| 25 | ₹ 157.25 | ₹ 3,931.25 |
| 10 | ₹ 161.89 | ₹ 1,618.90 |
| 1 | ₹ 173.55 | ₹ 173.55 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Tray | |
| Availability Status | Active | |
| RAM Technology Category | Non-Volatile | |
| Storage Media Type | FLASH | |
| Core Technology Platform | FLASH - NAND (SLC) | |
| Total Memory Bytes | 2Gbit | |
| Storage Layout Structure | 256M x 8 | |
| Data Access Bus | ONFI | |
| Timing Pulse Rate | - | |
| Memory Write Speed Word/Page | 25ns | |
| Data Retrieval Speed | - | |
| Power Supply Voltage | 2.7V ~ 3.6V | |
| Ambient Temp Range | -40°C ~ 85°C | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Attachment Mounting Style | Surface Mount | |
| Component Housing Style | - | |
| Vendor Package Type | 48-TSOP |
Description
Storage format FLASH for data interoperability. Memory bus ONFI for connectivity and performance. Memory arrangement 256M x 8 for optimal data retrieval. Memory total 2Gbit for device storage capability. Memory classification Non-Volatile for efficiency and compatibility. Mounting style Surface Mount for structural integrity. Operating temperature -40°C ~ 85°C for thermal stability. Enclosure Tray for component protection or transport. Enclosure type 48-TSOP ensuring device integrity. Product condition Active for availability and lifecycle. Manufacturer package type 48-TSOP for component choice. Voltage supply 2.7V ~ 3.6V for electrical needs. Platform technology FLASH - NAND (SLC) for the type of product. Operating supply voltage 2.7V ~ 3.6V for the device. Time taken to write per word or page 25ns for memory units.
