Stock: 4
Distributor: 111
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 304 | ₹ 1,791.57 | ₹ 5,44,637.28 |
| 250 | ₹ 1,810.26 | ₹ 4,52,565.00 |
| 152 | ₹ 1,833.40 | ₹ 2,78,676.80 |
| 100 | ₹ 1,852.09 | ₹ 1,85,209.00 |
| 50 | ₹ 1,892.14 | ₹ 94,607.00 |
| 25 | ₹ 1,914.39 | ₹ 47,859.75 |
| 10 | ₹ 1,993.60 | ₹ 19,936.00 |
| 1 | ₹ 2,047.89 | ₹ 2,047.89 |
Stock: 4
Distributor: 122
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 304 | ₹ 1,791.57 | ₹ 5,44,637.28 |
| 250 | ₹ 1,810.26 | ₹ 4,52,565.00 |
| 152 | ₹ 1,833.40 | ₹ 2,78,676.80 |
| 100 | ₹ 1,852.09 | ₹ 1,85,209.00 |
| 50 | ₹ 1,892.14 | ₹ 94,607.00 |
| 25 | ₹ 1,914.39 | ₹ 47,859.75 |
| 10 | ₹ 1,993.60 | ₹ 19,936.00 |
| 1 | ₹ 2,047.89 | ₹ 2,047.89 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Tray | |
| Availability Status | Active | |
| RAM Technology Category | Non-Volatile | |
| Storage Media Type | FLASH | |
| Core Technology Platform | FLASH - NAND (TLC) | |
| Total Memory Bytes | 1Tbit | |
| Storage Layout Structure | 128G x 8 | |
| Data Access Bus | eMMC | |
| Timing Pulse Rate | - | |
| Memory Write Speed Word/Page | - | |
| Data Retrieval Speed | - | |
| Power Supply Voltage | - | |
| Ambient Temp Range | -25°C ~ 85°C | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Attachment Mounting Style | Surface Mount | |
| Component Housing Style | 153-WFBGA | |
| Vendor Package Type | 153-FBGA (11.5x13) |
Description
Storage format FLASH for data interoperability. Memory bus eMMC for connectivity and performance. Memory arrangement 128G x 8 for optimal data retrieval. Memory total 1Tbit for device storage capability. Memory classification Non-Volatile for efficiency and compatibility. Mounting style Surface Mount for structural integrity. Operating temperature -25°C ~ 85°C for thermal stability. Enclosure Tray for component protection or transport. Enclosure/case 153-WFBGA providing mechanical and thermal shielding. Enclosure type 153-FBGA (11.5x13) ensuring device integrity. Product condition Active for availability and lifecycle. Manufacturer package type 153-FBGA (11.5x13) for component choice. Platform technology FLASH - NAND (TLC) for the type of product.
