Stock: 10
Distributor: 111
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1000 | ₹ 262.10 | ₹ 2,62,100.00 |
| 500 | ₹ 265.40 | ₹ 1,32,700.00 |
| 250 | ₹ 268.60 | ₹ 67,150.00 |
| 100 | ₹ 272.43 | ₹ 27,243.00 |
| 50 | ₹ 276.08 | ₹ 13,804.00 |
| 25 | ₹ 279.46 | ₹ 6,986.50 |
| 10 | ₹ 283.29 | ₹ 2,832.90 |
| 3 | ₹ 290.41 | ₹ 871.23 |
Stock: 10
Distributor: 122
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1000 | ₹ 262.10 | ₹ 2,62,100.00 |
| 500 | ₹ 265.40 | ₹ 1,32,700.00 |
| 250 | ₹ 268.60 | ₹ 67,150.00 |
| 100 | ₹ 272.43 | ₹ 27,243.00 |
| 50 | ₹ 276.08 | ₹ 13,804.00 |
| 25 | ₹ 279.46 | ₹ 6,986.50 |
| 10 | ₹ 283.29 | ₹ 2,832.90 |
| 1 | ₹ 290.41 | ₹ 290.41 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Tray | |
| Availability Status | Active | |
| RAM Technology Category | Volatile | |
| Storage Media Type | DRAM | |
| Core Technology Platform | SDRAM - DDR3L | |
| Total Memory Bytes | 2Gbit | |
| Storage Layout Structure | 128M x 16 | |
| Data Access Bus | Parallel | |
| Timing Pulse Rate | 1.066 GHz | |
| Memory Write Speed Word/Page | - | |
| Data Retrieval Speed | 20 ns | |
| Power Supply Voltage | 1.283V ~ 1.45V | |
| Ambient Temp Range | 0°C ~ 95°C (TC) | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Attachment Mounting Style | Surface Mount | |
| Component Housing Style | 96-TFBGA | |
| Vendor Package Type | 96-FBGA (7.5x13.5) |
Description
Reaches access speeds recorded at 20 ns for efficient data retrieval. Functions at a clock frequency of 1.066 GHz. Storage format DRAM for data interoperability. Memory bus Parallel for connectivity and performance. Memory arrangement 128M x 16 for optimal data retrieval. Memory total 2Gbit for device storage capability. Memory classification Volatile for efficiency and compatibility. Mounting style Surface Mount for structural integrity. Operating temperature 0°C ~ 95°C (TC) for thermal stability. Enclosure Tray for component protection or transport. Enclosure/case 96-TFBGA providing mechanical and thermal shielding. Enclosure type 96-FBGA (7.5x13.5) ensuring device integrity. Product condition Active for availability and lifecycle. Manufacturer package type 96-FBGA (7.5x13.5) for component choice. Voltage supply 1.283V ~ 1.45V for electrical needs. Platform technology SDRAM - DDR3L for the type of product. Operating supply voltage 1.283V ~ 1.45V for the device.
