Our team will assist you shortly.
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | eMCP | |
| IC Encapsulation Type | Tray | |
| Availability Status | Obsolete | |
| RAM Technology Category | Non-Volatile, Volatile | |
| Storage Media Type | FLASH, RAM | |
| Core Technology Platform | FLASH - NAND, DRAM - LPDDR | |
| Total Memory Bytes | 256Gbit (NAND), 16Gbit (LPDDR4 DRAM) | |
| Storage Layout Structure | - | |
| Data Access Bus | eMMC 5.1 HS400 + LPDDR4X | |
| Timing Pulse Rate | - | |
| Memory Write Speed Word/Page | - | |
| Data Retrieval Speed | - | |
| Power Supply Voltage | 1.8V, 3.3V | |
| Ambient Temp Range | -25°C ~ 85°C | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Attachment Mounting Style | Surface Mount | |
| Component Housing Style | 254-VFBGA | |
| Vendor Package Type | 254-FBGA (11.5x13) |
Description
Storage format FLASH, RAM for data interoperability. Memory bus eMMC 5.1 HS400 + LPDDR4X for connectivity and performance. Memory total 256Gbit (NAND), 16Gbit (LPDDR4 DRAM) for device storage capability. Memory classification Non-Volatile, Volatile for efficiency and compatibility. Mounting style Surface Mount for structural integrity. Operating temperature -25°C ~ 85°C for thermal stability. Enclosure Tray for component protection or transport. Enclosure/case 254-VFBGA providing mechanical and thermal shielding. Enclosure type 254-FBGA (11.5x13) ensuring device integrity. Product condition Obsolete for availability and lifecycle. Product or component classification series eMCP. Manufacturer package type 254-FBGA (11.5x13) for component choice. Voltage supply 1.8V, 3.3V for electrical needs. Platform technology FLASH - NAND, DRAM - LPDDR for the type of product. Operating supply voltage 1.8V, 3.3V for the device.
