Stock: 1
Distributor: 117
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 500 | ₹ 1,587.14 | ₹ 7,93,570.00 |
| 250 | ₹ 1,628.49 | ₹ 4,07,122.50 |
| 100 | ₹ 1,684.25 | ₹ 1,68,425.00 |
| 50 | ₹ 1,727.12 | ₹ 86,356.00 |
| 25 | ₹ 1,770.39 | ₹ 44,259.75 |
| 10 | ₹ 1,828.06 | ₹ 18,280.60 |
| 1 | ₹ 1,973.13 | ₹ 1,973.13 |
Stock: 20
Distributor: 108
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ₹ 1,776.44 | ₹ 1,776.44 |
| 10 | ₹ 1,646.50 | ₹ 16,465.00 |
| 25 | ₹ 1,610.01 | ₹ 40,250.25 |
| 50 | ₹ 1,569.96 | ₹ 78,498.00 |
| 100 | ₹ 1,500.54 | ₹ 1,50,054.00 |
| 250 | ₹ 1,462.27 | ₹ 3,65,567.50 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | e•MMC™ | |
| IC Encapsulation Type | Tray | |
| Availability Status | Active | |
| RAM Technology Category | Non-Volatile | |
| Storage Media Type | FLASH | |
| Core Technology Platform | FLASH - NAND (TLC) | |
| Total Memory Bytes | 512Gbit | |
| Storage Layout Structure | 64G x 8 | |
| Data Access Bus | eMMC_5.1 | |
| Timing Pulse Rate | 200 MHz | |
| Memory Write Speed Word/Page | - | |
| Data Retrieval Speed | - | |
| Power Supply Voltage | 2.7V ~ 3.6V | |
| Ambient Temp Range | -25°C ~ 85°C | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Attachment Mounting Style | Surface Mount | |
| Component Housing Style | 153-WFBGA | |
| Vendor Package Type | 153-FBGA (11.5x13) |
Description
Functions at a clock frequency of 200 MHz. Storage format FLASH for data interoperability. Memory bus eMMC_5.1 for connectivity and performance. Memory arrangement 64G x 8 for optimal data retrieval. Memory total 512Gbit for device storage capability. Memory classification Non-Volatile for efficiency and compatibility. Mounting style Surface Mount for structural integrity. Operating temperature -25°C ~ 85°C for thermal stability. Enclosure Tray for component protection or transport. Enclosure/case 153-WFBGA providing mechanical and thermal shielding. Enclosure type 153-FBGA (11.5x13) ensuring device integrity. Product condition Active for availability and lifecycle. Product or component classification series e•MMC™. Manufacturer package type 153-FBGA (11.5x13) for component choice. Voltage supply 2.7V ~ 3.6V for electrical needs. Platform technology FLASH - NAND (TLC) for the type of product. Operating supply voltage 2.7V ~ 3.6V for the device.
