Stock: 304
Distributor: 157
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 304 | ₹ 2,364.73 | ₹ 7,18,877.92 |
| 152 | ₹ 2,561.42 | ₹ 3,89,335.84 |
Stock: 59
Distributor: 117
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 250 | ₹ 2,445.26 | ₹ 6,11,315.00 |
| 100 | ₹ 2,529.53 | ₹ 2,52,953.00 |
| 50 | ₹ 2,594.46 | ₹ 1,29,723.00 |
| 25 | ₹ 2,660.21 | ₹ 66,505.25 |
| 10 | ₹ 2,747.96 | ₹ 27,479.60 |
| 1 | ₹ 2,969.93 | ₹ 2,969.93 |
Stock: 124
Distributor: 108
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ₹ 2,711.83 | ₹ 2,711.83 |
| 10 | ₹ 2,581.00 | ₹ 25,810.00 |
| 50 | ₹ 2,580.11 | ₹ 1,29,005.50 |
| 250 | ₹ 2,227.67 | ₹ 5,56,917.50 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | I-Temp e•MMC™ | |
| IC Encapsulation Type | Tray | |
| Availability Status | Active | |
| RAM Technology Category | Non-Volatile | |
| Storage Media Type | FLASH | |
| Core Technology Platform | FLASH - NAND (TLC) | |
| Total Memory Bytes | 512Gbit | |
| Storage Layout Structure | 64G x 8 | |
| Data Access Bus | eMMC_5.1 | |
| Timing Pulse Rate | - | |
| Memory Write Speed Word/Page | - | |
| Data Retrieval Speed | - | |
| Power Supply Voltage | - | |
| Ambient Temp Range | -40°C ~ 85°C | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Attachment Mounting Style | Surface Mount | |
| Component Housing Style | 153-WFBGA | |
| Vendor Package Type | 153-FBGA (11.5x13) |
Description
Storage format FLASH for data interoperability. Memory bus eMMC_5.1 for connectivity and performance. Memory arrangement 64G x 8 for optimal data retrieval. Memory total 512Gbit for device storage capability. Memory classification Non-Volatile for efficiency and compatibility. Mounting style Surface Mount for structural integrity. Operating temperature -40°C ~ 85°C for thermal stability. Enclosure Tray for component protection or transport. Enclosure/case 153-WFBGA providing mechanical and thermal shielding. Enclosure type 153-FBGA (11.5x13) ensuring device integrity. Product condition Active for availability and lifecycle. Product or component classification series I-Temp e•MMC™. Manufacturer package type 153-FBGA (11.5x13) for component choice. Platform technology FLASH - NAND (TLC) for the type of product.
