Stock: 152
Distributor: 108
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 152 | ₹ 7,602.38 | ₹ 11,55,561.76 |
Stock: 70
Distributor: 157
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 70 | ₹ 7,740.33 | ₹ 5,41,823.10 |
| 2 | ₹ 8,385.58 | ₹ 16,771.16 |
Stock: 151
Distributor: 117
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 50 | ₹ 8,252.47 | ₹ 4,12,623.50 |
| 25 | ₹ 8,466.46 | ₹ 2,11,661.50 |
| 10 | ₹ 8,754.31 | ₹ 87,543.10 |
| 1 | ₹ 9,492.74 | ₹ 9,492.74 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | I-Temp e•MMC™ | |
| IC Encapsulation Type | Tray | |
| Availability Status | Active | |
| RAM Technology Category | Non-Volatile | |
| Storage Media Type | FLASH | |
| Core Technology Platform | FLASH - NAND (TLC) | |
| Total Memory Bytes | 2Tbit | |
| Storage Layout Structure | 256G x 8 | |
| Data Access Bus | eMMC_5.1 | |
| Timing Pulse Rate | - | |
| Memory Write Speed Word/Page | - | |
| Data Retrieval Speed | - | |
| Power Supply Voltage | - | |
| Ambient Temp Range | -40°C ~ 85°C | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Attachment Mounting Style | Surface Mount | |
| Component Housing Style | 153-VFBGA | |
| Vendor Package Type | 153-FBGA (11.5x13) |
Description
Storage format FLASH for data interoperability. Memory bus eMMC_5.1 for connectivity and performance. Memory arrangement 256G x 8 for optimal data retrieval. Memory total 2Tbit for device storage capability. Memory classification Non-Volatile for efficiency and compatibility. Mounting style Surface Mount for structural integrity. Operating temperature -40°C ~ 85°C for thermal stability. Enclosure Tray for component protection or transport. Enclosure/case 153-VFBGA providing mechanical and thermal shielding. Enclosure type 153-FBGA (11.5x13) ensuring device integrity. Product condition Active for availability and lifecycle. Product or component classification series I-Temp e•MMC™. Manufacturer package type 153-FBGA (11.5x13) for component choice. Platform technology FLASH - NAND (TLC) for the type of product.
