EM08APGD3-AC224-2
Data Sheet
Attribute
Description
Manufacturer Part Number
EM08APGD3-AC224-2
Manufacturer
Description
IC MEMORY
Manufacturer Lead Time
Not specified
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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Tray | |
| Availability Status | Obsolete | |
| RAM Technology Category | - | |
| Storage Media Type | - | |
| Core Technology Platform | - | |
| Total Memory Bytes | - | |
| Storage Layout Structure | - | |
| Data Access Bus | - | |
| Timing Pulse Rate | - | |
| Memory Write Speed Word/Page | - | |
| Data Retrieval Speed | - | |
| Power Supply Voltage | - | |
| Ambient Temp Range | - | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Attachment Mounting Style | Surface Mount | |
| Component Housing Style | 153-VFBGA | |
| Vendor Package Type | 153-FBGA (11.5x13) |
Description
Mounting style Surface Mount for structural integrity. Enclosure Tray for component protection or transport. Enclosure/case 153-VFBGA providing mechanical and thermal shielding. Enclosure type 153-FBGA (11.5x13) ensuring device integrity. Product condition Obsolete for availability and lifecycle. Manufacturer package type 153-FBGA (11.5x13) for component choice.
