Stock: 2560
Distributor: 135
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 10000 | ₹ 201.14 | ₹ 20,11,400.00 |
| 1000 | ₹ 214.49 | ₹ 2,14,490.00 |
| 500 | ₹ 226.95 | ₹ 1,13,475.00 |
| 100 | ₹ 239.41 | ₹ 23,941.00 |
| 25 | ₹ 251.87 | ₹ 6,296.75 |
Stock: 2560
Distributor: 160
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 10000 | ₹ 201.14 | ₹ 20,11,400.00 |
| 1000 | ₹ 214.49 | ₹ 2,14,490.00 |
| 500 | ₹ 226.95 | ₹ 1,13,475.00 |
| 100 | ₹ 239.41 | ₹ 23,941.00 |
| 25 | ₹ 251.87 | ₹ 6,296.75 |
Stock: 2560
Distributor: 111
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 10000 | ₹ 251.43 | ₹ 25,14,300.00 |
| 1000 | ₹ 268.11 | ₹ 2,68,110.00 |
| 500 | ₹ 283.69 | ₹ 1,41,845.00 |
| 112 | ₹ 299.26 | ₹ 33,517.12 |
Stock: 2560
Distributor: 117
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 85 | ₹ 315.06 | ₹ 26,780.10 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| RAM Technology Category | Non-Volatile | |
| Storage Media Type | EEPROM | |
| Core Technology Platform | EEPROM | |
| Total Memory Bytes | 512Kbit | |
| Storage Layout Structure | 64K x 8 | |
| Data Access Bus | SPI | |
| Timing Pulse Rate | 20 MHz | |
| Memory Write Speed Word/Page | 5ms | |
| Data Retrieval Speed | - | |
| Power Supply Voltage | 1.8V ~ 5.5V | |
| Ambient Temp Range | -40°C ~ 85°C (TA) | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Attachment Mounting Style | Surface Mount | |
| Component Housing Style | Die | |
| Vendor Package Type | Wafer |
Description
Functions at a clock frequency of 20 MHz. Storage format EEPROM for data interoperability. Memory bus SPI for connectivity and performance. Memory arrangement 64K x 8 for optimal data retrieval. Memory total 512Kbit for device storage capability. Memory classification Non-Volatile for efficiency and compatibility. Mounting style Surface Mount for structural integrity. Operating temperature -40°C ~ 85°C (TA) for thermal stability. Enclosure Bulk for component protection or transport. Enclosure/case Die providing mechanical and thermal shielding. Enclosure type Wafer ensuring device integrity. Product condition Active for availability and lifecycle. Manufacturer package type Wafer for component choice. Voltage supply 1.8V ~ 5.5V for electrical needs. Platform technology EEPROM for the type of product. Operating supply voltage 1.8V ~ 5.5V for the device. Time taken to write per word or page 5ms for memory units.

