AT25512-W-11

AT25512-W-11
Attribute
Description
Manufacturer Part Number
AT25512-W-11
Manufacturer
Description
IC EEPROM 512KBIT SPI WAFER
Note : GST will not be applied to orders shipping outside of India

Stock:
2560

Distributor: 135

Lead Time: Not specified

Quantity Unit Price Ext. Price
10000 ₹ 201.14 ₹ 20,11,400.00
1000 ₹ 214.49 ₹ 2,14,490.00
500 ₹ 226.95 ₹ 1,13,475.00
100 ₹ 239.41 ₹ 23,941.00
25 ₹ 251.87 ₹ 6,296.75

Stock:
2560

Distributor: 160

Lead Time: Not specified


Quantity Unit Price Ext. Price
10000 ₹ 201.14 ₹ 20,11,400.00
1000 ₹ 214.49 ₹ 2,14,490.00
500 ₹ 226.95 ₹ 1,13,475.00
100 ₹ 239.41 ₹ 23,941.00
25 ₹ 251.87 ₹ 6,296.75

Stock:
2560

Distributor: 111

Lead Time: Not specified


Quantity Unit Price Ext. Price
10000 ₹ 251.43 ₹ 25,14,300.00
1000 ₹ 268.11 ₹ 2,68,110.00
500 ₹ 283.69 ₹ 1,41,845.00
112 ₹ 299.26 ₹ 33,517.12

Stock:
2560

Distributor: 117

Lead Time: Not specified


Quantity Unit Price Ext. Price
85 ₹ 315.06 ₹ 26,780.10

Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line -
IC Encapsulation Type Bulk
Availability Status Active
RAM Technology Category Non-Volatile
Storage Media Type EEPROM
Core Technology Platform EEPROM
Total Memory Bytes 512Kbit
Storage Layout Structure 64K x 8
Data Access Bus SPI
Timing Pulse Rate 20 MHz
Memory Write Speed Word/Page 5ms
Data Retrieval Speed -
Power Supply Voltage 1.8V ~ 5.5V
Ambient Temp Range -40°C ~ 85°C (TA)
Quality Grade Level -
Certification Qualification -
Attachment Mounting Style Surface Mount
Component Housing Style Die
Vendor Package Type Wafer

Description

Functions at a clock frequency of 20 MHz. Storage format EEPROM for data interoperability. Memory bus SPI for connectivity and performance. Memory arrangement 64K x 8 for optimal data retrieval. Memory total 512Kbit for device storage capability. Memory classification Non-Volatile for efficiency and compatibility. Mounting style Surface Mount for structural integrity. Operating temperature -40°C ~ 85°C (TA) for thermal stability. Enclosure Bulk for component protection or transport. Enclosure/case Die providing mechanical and thermal shielding. Enclosure type Wafer ensuring device integrity. Product condition Active for availability and lifecycle. Manufacturer package type Wafer for component choice. Voltage supply 1.8V ~ 5.5V for electrical needs. Platform technology EEPROM for the type of product. Operating supply voltage 1.8V ~ 5.5V for the device. Time taken to write per word or page 5ms for memory units.

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