AS4C64M16D1-6TIN

AS4C64M16D1-6TIN
Attribute
Description
Manufacturer Part Number
AS4C64M16D1-6TIN
Manufacturer
Description
IC DRAM 1GBIT PAR 66TSOP II
Note : GST will not be applied to orders shipping outside of India

Stock:
216

Distributor: 116

Lead Time: Not specified

Quantity Unit Price Ext. Price
1728 ₹ 2,010.63 ₹ 34,74,368.64
864 ₹ 2,020.99 ₹ 17,46,135.36
432 ₹ 2,031.35 ₹ 8,77,543.20
216 ₹ 2,041.72 ₹ 4,41,011.52
108 ₹ 2,052.08 ₹ 2,21,624.64

Stock:
84

Distributor: 117

Lead Time: Not specified


Quantity Unit Price Ext. Price
324 ₹ 2,113.10 ₹ 6,84,644.40
108 ₹ 2,200.83 ₹ 2,37,689.64
50 ₹ 2,263.70 ₹ 1,13,185.00
25 ₹ 2,321.01 ₹ 58,025.25
10 ₹ 2,397.48 ₹ 23,974.80
1 ₹ 2,590.79 ₹ 2,590.79

Stock:
6

Distributor: 108

Lead Time: Not specified


Quantity Unit Price Ext. Price
1 ₹ 2,590.79 ₹ 2,590.79
10 ₹ 2,397.66 ₹ 23,976.60
25 ₹ 2,321.12 ₹ 58,028.00
50 ₹ 2,264.16 ₹ 1,13,208.00
108 ₹ 2,129.77 ₹ 2,30,015.16
216 ₹ 2,072.81 ₹ 4,47,726.96

Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line -
IC Encapsulation Type Tray
Availability Status Active
RAM Technology Category Volatile
Storage Media Type DRAM
Core Technology Platform SDRAM - DDR
Total Memory Bytes 1Gbit
Storage Layout Structure 64M x 16
Data Access Bus Parallel
Timing Pulse Rate 166 MHz
Memory Write Speed Word/Page 15ns
Data Retrieval Speed 700 ps
Power Supply Voltage 2.3V ~ 2.7V
Ambient Temp Range -40°C ~ 85°C (TA)
Quality Grade Level -
Certification Qualification -
Attachment Mounting Style Surface Mount
Component Housing Style 66-TSSOP (0.400", 10.16mm Width)
Vendor Package Type 66-TSOP II

Description

Reaches access speeds recorded at 700 ps for efficient data retrieval. Functions at a clock frequency of 166 MHz. Storage format DRAM for data interoperability. Memory bus Parallel for connectivity and performance. Memory arrangement 64M x 16 for optimal data retrieval. Memory total 1Gbit for device storage capability. Memory classification Volatile for efficiency and compatibility. Mounting style Surface Mount for structural integrity. Operating temperature -40°C ~ 85°C (TA) for thermal stability. Enclosure Tray for component protection or transport. Enclosure/case 66-TSSOP (0.400", 10.16mm Width) providing mechanical and thermal shielding. Enclosure type 66-TSOP II ensuring device integrity. Product condition Active for availability and lifecycle. Manufacturer package type 66-TSOP II for component choice. Voltage supply 2.3V ~ 2.7V for electrical needs. Platform technology SDRAM - DDR for the type of product. Operating supply voltage 2.3V ~ 2.7V for the device. Time taken to write per word or page 15ns for memory units.

Stay Up to Date

Subscribe to our newsletter to receiveour weekly feed.