Description

Offers connectivity alternatives specified by I2C, SPI, UART/USART for smooth integration. Incorporates core processor recognized as ARM® Cortex®-M0 for rapid processing. Constructed with core size indicated as 32-Bit. Incorporates data converters categorized as A/D 11x12b. Mounting style Surface Mount for structural integrity. Total I/O 15 for electronic links. Operating temperature -40°C ~ 85°C (TA) for thermal stability. Generator type Internal for producing frequencies. Enclosure Tape & Reel (TR)Cut Tape (CT)Digi-Reel® for component protection or transport. Enclosure/case 20-TSSOP (0.173", 4.40mm Width) providing mechanical and thermal shielding. Enclosure type 20-TSSOP ensuring device integrity. External devices DMA, POR, PWM, WDT for system connectivity and expansion. Product condition Active for availability and lifecycle. Firmware memory size 16KB (16K x 8) for storage capacity. Memory type FLASH for program storage technology. Size of RAM 4K x 8 for system or device specifications. Product or component classification series STM32F0. Velocity 48MHz for mechanical or data efficiency. Manufacturer package type 20-TSSOP for component choice. Voltage supply 2.4V ~ 3.6V for electrical needs. Vcc/Vdd power supply voltage 2.4V ~ 3.6V for electronic components.