Description

Offers connectivity alternatives specified by I2C, SPI, UART/USART for smooth integration. Incorporates core processor recognized as ARM® Cortex®-M0+ for rapid processing. Constructed with core size indicated as 32-Bit. Mounting style Surface Mount for structural integrity. Total I/O 14 for electronic links. Operating temperature -40°C ~ 105°C (TA) for thermal stability. Generator type Internal for producing frequencies. Enclosure Tape & Reel (TR)Cut Tape (CT)Digi-Reel® for component protection or transport. Enclosure/case 16-XFDFN providing mechanical and thermal shielding. Enclosure type 16-XSON (3.2x2.5) ensuring device integrity. External devices Brown-out Detect/Reset, POR, PWM, WDT for system connectivity and expansion. Product condition Active for availability and lifecycle. Firmware memory size 16KB (16K x 8) for storage capacity. Memory type FLASH for program storage technology. Size of RAM 4K x 8 for system or device specifications. Product or component classification series LPC81xM. Velocity 30MHz for mechanical or data efficiency. Manufacturer package type 16-XSON (3.2x2.5) for component choice. Voltage supply 1.8V ~ 3.6V for electrical needs. Vcc/Vdd power supply voltage 1.8V ~ 3.6V for electronic components.