Description

Offers connectivity alternatives specified by I2C, PMP, SPI, UART/USART for smooth integration. Incorporates core processor recognized as PIC for rapid processing. Constructed with core size indicated as 16-Bit. Incorporates data converters categorized as A/D 16x10b. Mounting style Surface Mount for structural integrity. Total I/O 69 for electronic links. Operating temperature -40°C ~ 85°C (TA) for thermal stability. Generator type Internal for producing frequencies. Enclosure Tray for component protection or transport. Enclosure/case 80-TQFP providing mechanical and thermal shielding. Enclosure type 80-TQFP (12x12) ensuring device integrity. External devices Brown-out Detect/Reset, LVD, POR, PWM, WDT for system connectivity and expansion. Product condition Active for availability and lifecycle. Firmware memory size 128KB (43K x 24) for storage capacity. Memory type FLASH for program storage technology. Size of RAM 16K x 8 for system or device specifications. Product or component classification series PIC® 24F. Velocity 32MHz for mechanical or data efficiency. Manufacturer package type 80-TQFP (12x12) for component choice. Voltage supply 2V ~ 3.6V for electrical needs. Vcc/Vdd power supply voltage 2V ~ 3.6V for electronic components.