Description

Offers connectivity alternatives specified by I2C, LINbus, SPI, UART/USART for smooth integration. Incorporates core processor recognized as PIC for rapid processing. Constructed with core size indicated as 8-Bit. Incorporates data converters categorized as A/D 17x10b; D/A 1x5b. Indicates EEPROM capacity quantified at 224 x 8. Mounting style Surface Mount for structural integrity. Total I/O 18 for electronic links. Operating temperature -40°C ~ 85°C (TA) for thermal stability. Generator type Internal for producing frequencies. Enclosure Tape & Reel (TR)Cut Tape (CT)Digi-Reel® for component protection or transport. Enclosure/case 20-UFQFN Exposed Pad providing mechanical and thermal shielding. Enclosure type 20-UQFN (4x4) ensuring device integrity. External devices Brown-out Detect/Reset, POR, PWM, WDT for system connectivity and expansion. Product condition Active for availability and lifecycle. Firmware memory size 14KB (8K x 14) for storage capacity. Memory type FLASH for program storage technology. Size of RAM 1K x 8 for system or device specifications. Product or component classification series PIC® XLP™ 16F. Velocity 32MHz for mechanical or data efficiency. Manufacturer package type 20-UQFN (4x4) for component choice. Voltage supply 1.8V ~ 3.6V for electrical needs. Vcc/Vdd power supply voltage 1.8V ~ 3.6V for electronic components.