TMPA900CMXBG(EY)
Data Sheet
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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Central CPU Unit | ARM9 | |
| Processor Core Dimensions | 32-Bit | |
| Operational Speed Rating | 200MHz | |
| Interconnect Options | EBI/EMI, I²C, Microwire, SPI, UART/USART, USB | |
| Random Access Memory Bytes | 91 | |
| Input/Output Port Count | - | |
| Firmware Storage Capacity | ROMless | |
| Code Storage Technology | - | |
| Non-Volatile Memory Capacity | 32K x 8 | |
| Core Supply Voltage | 1.4 V ~ 3.6 V | |
| Analog-Digital Transformers | A/D 8x10b | |
| Frequency Generator Category | Internal | |
| Ambient Temp Range | -20°C ~ 85°C | |
| Component Housing Style | 289-LFBGA |
Description
Measures resistance at forward current ROMless for LED or diode evaluation. Offers connectivity alternatives specified by EBI/EMI, I²C, Microwire, SPI, UART/USART, USB for smooth integration. Incorporates core processor recognized as ARM9 for rapid processing. Constructed with core size indicated as 32-Bit. Incorporates data converters categorized as A/D 8x10b. Indicates EEPROM capacity quantified at 32K x 8. Operating temperature -20°C ~ 85°C for thermal stability. Generator type Internal for producing frequencies. Enclosure/case 289-LFBGA providing mechanical and thermal shielding. Firmware memory size ROMless for storage capacity. Size of RAM 91 for system or device specifications. Velocity 200MHz for mechanical or data efficiency. Voltage supply 1.4 V ~ 3.6 V for electrical needs. Vcc/Vdd power supply voltage 1.4 V ~ 3.6 V for electronic components.
