STM32L152R8T6TR

STM32L152R8T6TR
Attribute
Description
Manufacturer Part Number
STM32L152R8T6TR
Manufacturer
Description
IC MCU 32BIT 64KB FLASH 64LQFP
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Stock:
16000

Distributor: 116

Lead Time: Not specified

Quantity Unit Price Ext. Price
16000 ₹ 353.60 ₹ 56,57,600.00
8000 ₹ 355.44 ₹ 28,43,520.00
4000 ₹ 357.28 ₹ 14,29,120.00
2000 ₹ 359.12 ₹ 7,18,240.00
1000 ₹ 360.97 ₹ 3,60,970.00

Stock:
1000

Distributor: 117

Lead Time: Not specified


Quantity Unit Price Ext. Price
1000 ₹ 368.34 ₹ 3,68,340.00

Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line STM32L1
IC Encapsulation Type Tape & Reel (TR)
Availability Status Active
Central CPU Unit ARM® Cortex®-M3
Processor Core Dimensions 32-Bit
Operational Speed Rating 32MHz
Interconnect Options I2C, IrDA, LINbus, SPI, UART/USART, USB
External Device Support Cap Sense, DMA, I2S, LCD, POR, PWM, WDT
Input/Output Port Count 51
Firmware Storage Capacity 64KB (64K x 8)
Code Storage Technology FLASH
Non-Volatile Memory Capacity 4K x 8
Random Access Memory Bytes 10K x 8
Core Supply Voltage 1.65V ~ 3.6V
Analog-Digital Transformers A/D 20x12b; D/A 2x12b
Frequency Generator Category Internal
Ambient Temp Range -40°C ~ 85°C (TA)
Quality Grade Level -
Certification Qualification -
Attachment Mounting Style Surface Mount
Vendor Package Type 64-LQFP (10x10)
Component Housing Style 64-LQFP

Description

Offers connectivity alternatives specified by I2C, IrDA, LINbus, SPI, UART/USART, USB for smooth integration. Incorporates core processor recognized as ARM® Cortex®-M3 for rapid processing. Constructed with core size indicated as 32-Bit. Incorporates data converters categorized as A/D 20x12b; D/A 2x12b. Indicates EEPROM capacity quantified at 4K x 8. Mounting style Surface Mount for structural integrity. Total I/O 51 for electronic links. Operating temperature -40°C ~ 85°C (TA) for thermal stability. Generator type Internal for producing frequencies. Enclosure Tape & Reel (TR) for component protection or transport. Enclosure/case 64-LQFP providing mechanical and thermal shielding. Enclosure type 64-LQFP (10x10) ensuring device integrity. External devices Cap Sense, DMA, I2S, LCD, POR, PWM, WDT for system connectivity and expansion. Product condition Active for availability and lifecycle. Firmware memory size 64KB (64K x 8) for storage capacity. Memory type FLASH for program storage technology. Size of RAM 10K x 8 for system or device specifications. Product or component classification series STM32L1. Velocity 32MHz for mechanical or data efficiency. Manufacturer package type 64-LQFP (10x10) for component choice. Voltage supply 1.65V ~ 3.6V for electrical needs. Vcc/Vdd power supply voltage 1.65V ~ 3.6V for electronic components.

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