Description

Offers connectivity alternatives specified by I2C, SPI, UART/USART for smooth integration. Incorporates core processor recognized as 8052 for rapid processing. Constructed with core size indicated as 8-Bit. Incorporates data converters categorized as A/D 8x12b; D/A 2x12b. Mounting style Surface Mount for structural integrity. Total I/O 32 for electronic links. Operating temperature -40°C ~ 85°C (TA) for thermal stability. Generator type Internal for producing frequencies. Enclosure Tray for component protection or transport. Enclosure/case 56-VFQFN Exposed Pad, CSP providing mechanical and thermal shielding. Enclosure type 56-LFCSP-VQ (8x8) ensuring device integrity. External devices DMA, PSM, PWM, Temp Sensor, WDT for system connectivity and expansion. Product condition Active for availability and lifecycle. Firmware memory size 32KB (32K x 8) for storage capacity. Memory type FLASH for program storage technology. Size of RAM 2.25K x 8 for system or device specifications. Product or component classification series MicroConverter® ADuC8xx. Velocity 16.78MHz for mechanical or data efficiency. Manufacturer package type 56-LFCSP-VQ (8x8) for component choice. Voltage supply 4.75V ~ 5.25V for electrical needs. Vcc/Vdd power supply voltage 4.75V ~ 5.25V for electronic components.