Attribute
Description
Manufacturer Part Number
ADSP-3PARCBF548M01
Manufacturer
Description
MODULE BOARD BF548
Manufacturer Lead Time
Not specified
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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | Blackfin® | |
| IC Encapsulation Type | Bulk | |
| Expansion Board Category | MPU Core | |
| Central CPU Unit | BF548 | |
| Auxiliary Processing Unit | - | |
| Operational Speed Rating | 533MHz | |
| Non-Volatile Flash Memory | 32MB | |
| Random Access Memory Bytes | 64MB | |
| Interface Connector Category | SO-DIMM-200 | |
| Package Size Specs | 2.240" L x 2.640" W (56.90mm x 67.00mm) | |
| Ambient Temp Range | -40°C ~ 85°C |
Description
Incorporates a connector type labeled as SO-DIMM-200. Incorporates core processor recognized as BF548 for rapid processing. Presents flash memory capacity rated at 32MB. Module or board type MPU Core for system compatibility. Operating temperature -40°C ~ 85°C for thermal stability. Enclosure Bulk for component protection or transport. Size of RAM 64MB for system or device specifications. Product or component classification series Blackfin®. Dimensions 2.240" L x 2.640" W (56.90mm x 67.00mm) for mechanical or electrical components. Dimension measurement 2.240" L x 2.640" W (56.90mm x 67.00mm) for component details. Velocity 533MHz for mechanical or data efficiency.
