Attribute
Description
Manufacturer Part Number
SH2000-160-160-0.30
Manufacturer
Description
HIGH INSULATED THERMAL PAD WITH
Manufacturer Lead Time
Not specified
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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | SH2000 | |
| IC Encapsulation Type | Bag | |
| Availability Status | Active | |
| Intended Usage Scenario | - | |
| Device Type Classification | Conductive Insulator Pad | |
| Physical Shape Form | Square | |
| Dimensional Outline Drawing | 160.00mm x 160.00mm | |
| Material Thickness Gauge | 0.0120" (0.305mm) | |
| Construction Material Type | Silicone | |
| Bonding Agent Type | - | |
| Support Layer Material | Fiberglass | |
| Visual Hue | Green | |
| Material Heat Resistance | - | |
| Heat Transfer Coefficient | 2.0W/m-K |
Description
Made with Fiberglass backing/carrier materials for longevity. Available in a color identified as Green to enhance system aesthetics. Material type Silicone for reliability and performance. Contour 160.00mm x 160.00mm for device shape and footprint. Enclosure Bag for component protection or transport. Product condition Active for availability and lifecycle. Product or component classification series SH2000. Form Square for device or component. Thermal conductivity value 2.0W/m-K for heat transfer efficiency. Thickness measurement 0.0120" (0.305mm) for material or component size. Category Conductive Insulator Pad for classification or specification.







