BS75K-160-160-1.0

BS75K-160-160-1.0
Attribute
Description
Manufacturer Part Number
BS75K-160-160-1.0
Description
THERM PAD 160MMX160MM GRAY
Manufacturer Lead Time
Not specified

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Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line BS75K
IC Encapsulation Type Bag
Availability Status Active
Intended Usage Scenario Multi
Device Type Classification Gap Filler Pad, Sheet
Physical Shape Form Square
Dimensional Outline Drawing 160.00mm x 160.00mm
Material Thickness Gauge 0.0390" (0.991mm)
Construction Material Type Silicone
Bonding Agent Type Tacky - Both Sides
Support Layer Material -
Visual Hue Gray
Material Heat Resistance -
Heat Transfer Coefficient 3.0W/m-K

Description

Uses Tacky - Both Sides adhesive for durable bonding. Available in a color identified as Gray to enhance system aesthetics. Material type Silicone for reliability and performance. Contour 160.00mm x 160.00mm for device shape and footprint. Enclosure Bag for component protection or transport. Product condition Active for availability and lifecycle. Product or component classification series BS75K. Form Square for device or component. Thermal conductivity value 3.0W/m-K for heat transfer efficiency. Thickness measurement 0.0390" (0.991mm) for material or component size. Category Gap Filler Pad, Sheet for classification or specification. Application Multi for intended use or function.

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