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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Cut Tape (CT) | |
| Availability Status | Active | |
| Semiconductor Diode Category | Single Phase | |
| Core Technology Platform | Standard | |
| Max Peak Reverse Volts | 1 kV | |
| Average DC Output Current | 500 mA | |
| Max Forward Voltage Drop | 1 V @ 400 mA | |
| Reverse Leak at Voltage | 5 µA @ 1000 V | |
| Ambient Temp Range | -55°C ~ 150°C (TJ) | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Attachment Mounting Style | Surface Mount | |
| Component Housing Style | TO-269AA, 4-BESOP | |
| Vendor Package Type | MBS |
Description
Delivers average rectified current (Io) recorded at 500 mA. Presents reverse leakage current quantified at 5 µA @ 1000 V at Vr. Includes diode type indicated as Single Phase. Mounting style Surface Mount for structural integrity. Operating temperature -55°C ~ 150°C (TJ) for thermal stability. Enclosure Cut Tape (CT) for component protection or transport. Enclosure/case TO-269AA, 4-BESOP providing mechanical and thermal shielding. Enclosure type MBS ensuring device integrity. Product condition Active for availability and lifecycle. Manufacturer package type MBS for component choice. Platform technology Standard for the type of product. Highest forward voltage Vf at If 1 V @ 400 mA for diodes. Maximum reverse voltage peak 1 kV for safeguarding.
