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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | Tariff may apply if shipping to the United States | |
| Product Series Line | - | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Obsolete | |
| Prototype Board Style | SMD to Plated Through Hole Board | |
| Supported Package Formats | SOIC, SSOP, 0805, DO-323, SOT23, XTAL, QFP | |
| Switch Position Options | 6, 8 | |
| Component Spacing Distance | 0.026" (0.65mm) | |
| Circuit Board Depth | - | |
| Construction Material Type | - | |
| Package Size Specs | 3.937" L x 3.150" W (100.00mm x 80.00mm) |
Description
Measures resistance at forward current Tariff may apply if shipping to the United States for LED or diode evaluation. Total positions 6, 8 for switches or mechanical elements. Enclosure Bulk for component protection or transport. Formats accepted SOIC, SSOP, 0805, DO-323, SOT23, XTAL, QFP for production or assembly. Spacing 0.026" (0.65mm) for component arrangement or connector alignment. Product condition Obsolete for availability and lifecycle. Development board type SMD to Plated Through Hole Board for prototyping. Dimensions 3.937" L x 3.150" W (100.00mm x 80.00mm) for mechanical or electrical components. Dimension measurement 3.937" L x 3.150" W (100.00mm x 80.00mm) for component details. Classification for tariffs Tariff may apply if shipping to the United States regarding import/export. Peak Vce(on) at Vge Tariff may apply if shipping to the United States for transistor parameters.
