Attribute
Description
Manufacturer Part Number
2597
Manufacturer
Description
BREAKOUT BOARD FOR MICROSD CARD
Manufacturer Lead Time
Not specified
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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Prototype Board Style | Plated Through Hole to Plated Through Hole | |
| Supported Package Formats | microSD™ Card | |
| Switch Position Options | 11 | |
| Component Spacing Distance | 0.100" (2.54mm) | |
| Circuit Board Depth | 0.120" (3.05mm) | |
| Construction Material Type | - | |
| Package Size Specs | 0.800" L x 0.700" W (20.32mm x 17.78mm) |
Description
Features a board thickness rated at 0.120" (3.05mm) for robust structural support. Total positions 11 for switches or mechanical elements. Enclosure Bulk for component protection or transport. Formats accepted microSD™ Card for production or assembly. Spacing 0.100" (2.54mm) for component arrangement or connector alignment. Product condition Active for availability and lifecycle. Development board type Plated Through Hole to Plated Through Hole for prototyping. Dimensions 0.800" L x 0.700" W (20.32mm x 17.78mm) for mechanical or electrical components. Dimension measurement 0.800" L x 0.700" W (20.32mm x 17.78mm) for component details.
