Attribute
Description
Manufacturer Part Number
OSDZU3EG1-2G-BFB
Manufacturer
Description
SYSTEM-IN-PACKAGE: AMD ZYNQ ULTR
Manufacturer Lead Time
Not specified
Our team will assist you shortly.
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Tray | |
| Availability Status | Active | |
| Expansion Board Category | MPU Core | |
| Central CPU Unit | ARM® Cortex®-R5F, ARM® Quad Cortex®-A53 | |
| Auxiliary Processing Unit | - | |
| Operational Speed Rating | 500MHz, 1.2GHz | |
| Non-Volatile Flash Memory | 128MB | |
| Random Access Memory Bytes | 2GB | |
| Interface Connector Category | 600-BGA | |
| Package Size Specs | 1.570" L x 0.807" W (40.00mm x 20.50mm) | |
| Ambient Temp Range | 0°C ~ 85°C |
Description
Incorporates a connector type labeled as 600-BGA. Incorporates core processor recognized as ARM® Cortex®-R5F, ARM® Quad Cortex®-A53 for rapid processing. Presents flash memory capacity rated at 128MB. Module or board type MPU Core for system compatibility. Operating temperature 0°C ~ 85°C for thermal stability. Enclosure Tray for component protection or transport. Product condition Active for availability and lifecycle. Size of RAM 2GB for system or device specifications. Dimensions 1.570" L x 0.807" W (40.00mm x 20.50mm) for mechanical or electrical components. Dimension measurement 1.570" L x 0.807" W (40.00mm x 20.50mm) for component details. Velocity 500MHz, 1.2GHz for mechanical or data efficiency.
