Attribute
Description
Manufacturer Part Number
MIKROE-310
Manufacturer
Description
TSSOP-SSOP-28 TO DIP28-600MIL AD
Manufacturer Lead Time
5 weeks
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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Box | |
| Availability Status | Active | |
| Prototype Board Style | SMD to DIP | |
| Supported Package Formats | SSOP, TSSOP | |
| Switch Position Options | 28 | |
| Component Spacing Distance | 0.026" (0.65mm) | |
| Circuit Board Depth | - | |
| Construction Material Type | FR4 Epoxy Glass | |
| Package Size Specs | - |
Description
Material type FR4 Epoxy Glass for reliability and performance. Total positions 28 for switches or mechanical elements. Enclosure Box for component protection or transport. Formats accepted SSOP, TSSOP for production or assembly. Spacing 0.026" (0.65mm) for component arrangement or connector alignment. Product condition Active for availability and lifecycle. Development board type SMD to DIP for prototyping.
