Attribute
Description
Manufacturer Part Number
MIKROE-308
Manufacturer
Description
TSSOP-SSOP-24 TO DIP24-300MIL AD
Note :
GST will not be applied to orders shipping outside of India
Stock: 1
Distributor: 130
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ₹ 482.11 | ₹ 482.11 |
| 5 | ₹ 472.47 | ₹ 2,362.35 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Box | |
| Availability Status | Active | |
| Prototype Board Style | SMD to DIP | |
| Supported Package Formats | SSOP, TSSOP | |
| Switch Position Options | 24 | |
| Component Spacing Distance | 0.026" (0.65mm) | |
| Circuit Board Depth | - | |
| Construction Material Type | FR4 Epoxy Glass | |
| Package Size Specs | - |
Description
Material type FR4 Epoxy Glass for reliability and performance. Total positions 24 for switches or mechanical elements. Enclosure Box for component protection or transport. Formats accepted SSOP, TSSOP for production or assembly. Spacing 0.026" (0.65mm) for component arrangement or connector alignment. Product condition Active for availability and lifecycle. Development board type SMD to DIP for prototyping.
