Attribute
Description
Manufacturer Part Number
MIKROE-303
Manufacturer
Description
TSSOP-SSOP-8 TO DIP8-300MIL ADAP
Manufacturer Lead Time
5 weeks
Our team will assist you shortly.
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Box | |
| Availability Status | Active | |
| Prototype Board Style | SMD to DIP | |
| Supported Package Formats | SSOP, TSSOP | |
| Switch Position Options | 8 | |
| Component Spacing Distance | 0.026" (0.65mm) | |
| Circuit Board Depth | - | |
| Construction Material Type | FR4 Epoxy Glass | |
| Package Size Specs | - |
Description
Material type FR4 Epoxy Glass for reliability and performance. Total positions 8 for switches or mechanical elements. Enclosure Box for component protection or transport. Formats accepted SSOP, TSSOP for production or assembly. Spacing 0.026" (0.65mm) for component arrangement or connector alignment. Product condition Active for availability and lifecycle. Development board type SMD to DIP for prototyping.
