Attribute
Description
Manufacturer Part Number
MIKROE-302
Manufacturer
Description
SOIC-SOP-8 TO DIP8-300MIL ADAPTE
Manufacturer Lead Time
5 weeks
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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Obsolete | |
| Prototype Board Style | SMD to DIP | |
| Supported Package Formats | SOIC, SOP | |
| Switch Position Options | 8 | |
| Component Spacing Distance | - | |
| Circuit Board Depth | - | |
| Construction Material Type | FR4 Epoxy Glass | |
| Package Size Specs | - |
Description
Material type FR4 Epoxy Glass for reliability and performance. Total positions 8 for switches or mechanical elements. Enclosure Bulk for component protection or transport. Formats accepted SOIC, SOP for production or assembly. Product condition Obsolete for availability and lifecycle. Development board type SMD to DIP for prototyping.
