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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | Tariff may apply if shipping to the United States | |
| Product Series Line | - | |
| IC Encapsulation Type | Tray | |
| Availability Status | Active | |
| Central CPU Unit | XBurst® 1 | |
| Bus Core Width Bits | 1 Core, 32-Bit | |
| Operational Speed Rating | 1GHz | |
| Digital Signal Processors | - | |
| Memory Management Units | DDR2, LPDDR2, LVDDR2 | |
| GPU Speed Enhancement | No | |
| Screen and UI Processors | DVP, LCD, MIPI-CSI, RGB | |
| Network Ethernet Standard | 10/100Mbps (1) | |
| Serial ATA Interface | - | |
| USB Interface Version | USB 2.0 OTG (1) | |
| Input/Output Voltage Level | 1.8V, 3.3V | |
| Ambient Temp Range | -40°C ~ 85°C (TA) | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Data Protection Measures | AES, Boot Security, Encryption Engine, MD5, Random Number Generator, SHA-1/2 | |
| Attachment Mounting Style | Surface Mount | |
| Component Housing Style | 159-LFBGA | |
| Vendor Package Type | 159-BGA (9x9) | |
| Extra Connectivity Ports | AIC, CIM, CSI, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, SPI, UART |
Description
Features additional interface options rated at AIC, CIM, CSI, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, SPI, UART for enhanced functionality. Measures resistance at forward current Tariff may apply if shipping to the United States for LED or diode evaluation. Incorporates core processor recognized as XBurst® 1 for rapid processing. Incorporates display and interface processors specified as DVP, LCD, MIPI-CSI, RGB. Supports Ethernet standard rated to 10/100Mbps (1). Provides No graphics acceleration for seamless visual performance. Mounting style Surface Mount for structural integrity. Bus width or cores 1 Core, 32-Bit for digital applications. Operating temperature -40°C ~ 85°C (TA) for thermal stability. Output voltage 1.8V, 3.3V for electrical efficiency. Enclosure Tray for component protection or transport. Enclosure/case 159-LFBGA providing mechanical and thermal shielding. Enclosure type 159-BGA (9x9) ensuring device integrity. Product condition Active for availability and lifecycle. Controllers for RAM DDR2, LPDDR2, LVDDR2 for managing memory. Protection features AES, Boot Security, Encryption Engine, MD5, Random Number Generator, SHA-1/2 for device security. Velocity 1GHz for mechanical or data efficiency. Manufacturer package type 159-BGA (9x9) for component choice. Classification for tariffs Tariff may apply if shipping to the United States regarding import/export. USB version USB 2.0 OTG (1) for connectivity. Peak Vce(on) at Vge Tariff may apply if shipping to the United States for transistor parameters. I/O voltage level 1.8V, 3.3V for digital interfaces.
