GS8162Z36DGD-250I
Data Sheet
Stock: 1152
Distributor: 116
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1152 | ₹ 1,274.55 | ₹ 14,68,281.60 |
| 864 | ₹ 1,296.34 | ₹ 11,20,037.76 |
| 576 | ₹ 1,318.13 | ₹ 7,59,242.88 |
| 288 | ₹ 1,339.91 | ₹ 3,85,894.08 |
| 144 | ₹ 1,361.70 | ₹ 1,96,084.80 |
Stock: 36
Distributor: 117
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 36 | ₹ 1,861.14 | ₹ 67,001.04 |
Stock: 1
Distributor: 108
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ₹ 2,118.20 | ₹ 2,118.20 |
| 10 | ₹ 1,963.34 | ₹ 19,633.40 |
| 25 | ₹ 1,861.88 | ₹ 46,547.00 |
| 36 | ₹ 1,860.99 | ₹ 66,995.64 |
| 108 | ₹ 1,820.05 | ₹ 1,96,565.40 |
| 252 | ₹ 1,795.13 | ₹ 4,52,372.76 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Tray | |
| Availability Status | Active | |
| RAM Technology Category | Volatile | |
| Storage Media Type | SRAM | |
| Core Technology Platform | SRAM - Synchronous, ZBT | |
| Total Memory Bytes | 18Mbit | |
| Storage Layout Structure | 512K x 36 | |
| Data Access Bus | Parallel | |
| Timing Pulse Rate | 250 MHz | |
| Memory Write Speed Word/Page | - | |
| Data Retrieval Speed | - | |
| Power Supply Voltage | 2.3V ~ 2.7V, 3V ~ 3.6V | |
| Ambient Temp Range | -40°C ~ 100°C (TJ) | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Attachment Mounting Style | Surface Mount | |
| Component Housing Style | 165-LBGA | |
| Vendor Package Type | 165-FPBGA (15x13) |
Description
Functions at a clock frequency of 250 MHz. Storage format SRAM for data interoperability. Memory bus Parallel for connectivity and performance. Memory arrangement 512K x 36 for optimal data retrieval. Memory total 18Mbit for device storage capability. Memory classification Volatile for efficiency and compatibility. Mounting style Surface Mount for structural integrity. Operating temperature -40°C ~ 100°C (TJ) for thermal stability. Enclosure Tray for component protection or transport. Enclosure/case 165-LBGA providing mechanical and thermal shielding. Enclosure type 165-FPBGA (15x13) ensuring device integrity. Product condition Active for availability and lifecycle. Manufacturer package type 165-FPBGA (15x13) for component choice. Voltage supply 2.3V ~ 2.7V, 3V ~ 3.6V for electrical needs. Platform technology SRAM - Synchronous, ZBT for the type of product. Operating supply voltage 2.3V ~ 2.7V, 3V ~ 3.6V for the device.
