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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | Tariff may apply if shipping to the United States | |
| Product Series Line | BDN | |
| IC Encapsulation Type | Box | |
| Availability Status | Active | |
| Device Type Classification | Top Mount | |
| Thermal Package Design | Assorted (BGA, LGA, CPU, ASIC...) | |
| Mounting Technique | Thermal Tape, Adhesive (Included) | |
| Physical Shape Form | Square, Pin Fins | |
| Linear Length Dimension | 1.810" (45.97mm) | |
| Horizontal Width Dimension | 1.810" (45.97mm) | |
| Circular Measurement | - | |
| Heat Sink Fin Elevation | 0.605" (15.37mm) | |
| Power at Temp Increase | - | |
| Thermal Resistance with Fan | 2.80°C/W @ 400 LFM | |
| Passive Cooling Resistance | 8.10°C/W | |
| Construction Material Type | Aluminum | |
| Surface Material Treatment | Black Anodized |
Description
Secured using a Thermal Tape, Adhesive (Included) approach for stable positioning. Measures resistance at forward current Tariff may apply if shipping to the United States for LED or diode evaluation. Has fin height recorded at 0.605" (15.37mm). Total length 1.810" (45.97mm) for size reference. Material type Aluminum for reliability and performance. Finish Black Anodized for both protection and visual appeal. Enclosure Box for component protection or transport. Thermal management package Assorted (BGA, LGA, CPU, ASIC...) for cooling purposes. Product condition Active for availability and lifecycle. Product or component classification series BDN. Form Square, Pin Fins for device or component. Classification for tariffs Tariff may apply if shipping to the United States regarding import/export. Thermal resistance under forced airflow 2.80°C/W @ 400 LFM for cooling effectiveness. Thermal resistance during natural convection 8.10°C/W for heat release. Category Top Mount for classification or specification. Peak Vce(on) at Vge Tariff may apply if shipping to the United States for transistor parameters. Horizontal dimension width 1.810" (45.97mm).
