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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | APR | |
| IC Encapsulation Type | Tray | |
| Availability Status | Active | |
| Device Type Classification | Top Mount | |
| Thermal Package Design | Assorted (BGA, LGA, CPU, ASIC...) | |
| Mounting Technique | Thermal Tape, Adhesive (Included) | |
| Physical Shape Form | Square, Pin Fins | |
| Linear Length Dimension | 1.126" (28.60mm) | |
| Horizontal Width Dimension | 1.126" (28.60mm) | |
| Circular Measurement | - | |
| Heat Sink Fin Elevation | 0.457" (11.60mm) | |
| Power at Temp Increase | - | |
| Thermal Resistance with Fan | 4.25°C/W @ 200 LFM | |
| Passive Cooling Resistance | 12.58°C/W | |
| Construction Material Type | Aluminum Alloy | |
| Surface Material Treatment | Black Anodized |
Description
Secured using a Thermal Tape, Adhesive (Included) approach for stable positioning. Has fin height recorded at 0.457" (11.60mm). Total length 1.126" (28.60mm) for size reference. Material type Aluminum Alloy for reliability and performance. Finish Black Anodized for both protection and visual appeal. Enclosure Tray for component protection or transport. Thermal management package Assorted (BGA, LGA, CPU, ASIC...) for cooling purposes. Product condition Active for availability and lifecycle. Product or component classification series APR. Form Square, Pin Fins for device or component. Thermal resistance under forced airflow 4.25°C/W @ 200 LFM for cooling effectiveness. Thermal resistance during natural convection 12.58°C/W for heat release. Category Top Mount for classification or specification. Horizontal dimension width 1.126" (28.60mm).
